Dense-Pac Microsystems receives order from GEC Marconi Avionics valued at $1,425,000

Business Wire, Feb 5, 1996

GARDEN GROVE, Calif.--(BUSINESS WIRE)--Feb. 5, 1996--Dense-Pac Microsystems Inc. (NASDAQ:DPAC) Monday announced that the company has received from GEC Marconi Avionics a purchase agreement valued at $1,425,000 for Dense-Pac's first generation 3-Dimensional stackable memory product.

The product will be utilized in the upgrade of avionics equipment. Delivery is scheduled over the next twelve months.

"We are pleased to receive this additional order from GEC Marconi with the patented product designed into a mass storage unit for avionics equipment. This order represents a significant win for Dense-Pac with its stackable memory technology," said James G. Turner, chief executive officer.

Dense-Pac Microsystems Inc. is a designer and manufacturer of proprietary computer chip stacking technologies that allow the company's government and commercial customers to pack huge amounts of memory into small spaces. Its memory technology can be used in such diverse areas as space satellites and space missiles, high performance auto engines, computers and cellular telephones.

CONTACT: Dense-Pac Microsystems Inc.

William Stowell, 714/898-0007

or

Stern & Co.

Richard Stern/Henry Ling, 212/777-7722