HP Offers Tools for RFIC Design in New Integrated Package

Business Wire, June 13, 1996

PALO ALTO, Calif.--(BUSINESS WIRE)--June 13, 1996-- Hewlett-Packard Company today announces the HP RFIC Simulation Suite, a software package that provides all the simulation tools an engineer needs for RFIC (radio-frequency integrated circuit) design in one complete integrated package. The software package was designed to shorten the design cycle in wireless applications and enhance performance and yield by offering multiple simulation technologies combined with accurate models, efficient optimization and powerful statistical design.

The HP RFIC Simulation Suite, developed by the HP EEsof Division, combines -- in a dedicated package tailored to the RFIC designer -- a broad range of leading-edge, high-frequency simulation technologies with accurate models. Additionally, the suite offers the ability to add custom models independently into the RFIC simulators and to fit them to measured data through a parameter-extraction system. When analytical models exceed their range of validity or are nonexistent, as in the case of spiral inductors on silicon, HP's electromagnetic simulators fill the void to maintain the overall RFIC simulation accuracy. In addition, users may develop their own linear and nonlinear models to enhance accuracy for in-house RFIC foundry processes and to fit them to measured data through a parameter-extraction system.

THE HP BASIC RFIC SIMULATION SUITE

The HP Basic RFIC Simulation Suite is available in both the Series IV and in Microwave Design System (MDS) software environments on the UNIX(r) system and on the PC platform in Series IV. The following are included in the basic suite:

- linear simulator -- analyzes and optimizes low-noise

amplifiers, matching networks and oscillators;

- nonlinear simulator -- analyzes and optimizes mixer

intermodulation products, frequency-conversion noise

figure, amplifier compression, power-added efficiency and

oscillator phase noise;

- transient and convolution simulators -- analyze transient

responses of circuits containing lumped and distributed

components;

- statistical design package -- ensures robust RFIC design

to tolerate process variations with the goal of achieving

acceptable production yields;

- custom model development kit -- conveniently enables the

addition of user-defined and foundry models to the

simulation environment; and

- SPICE netlist translator -- imports Berkeley 2G6, PSpice

and HSPICE netlists.

THE PROFESSIONAL RFIC SIMULATION SUITE

The HP Professional RFIC Simulation Suite, available only in the MDS UNIX system environment, extends the basic RFIC simulation capabilities to include the following:

- HP Circuit Envelope simulator -- designed to efficiently

simulate circuits with transient and digitally modulated

RF signals, such as TDMA and CDMA, providing modern

wireless-performance measures, such as spectral regrowth,

PLL acquisition time and mixer 3rd-, 5th-, 7th-order

intermodulation products;

- system model library -- facilitates RFIC design

partitioning and subsystem analysis;

- SPICE model generator -- generates SPICE

equivalent-circuit netlists from S-parameter data;

and

- physical design -- draws critical aspects of the

layout geometry for analysis and preview before full

layout on other dedicated IC-layout tools. A GDSII

translator facilitates layout-data interchange.

U.S. PRICE AND AVAILABILITY

The RFIC Basic Simulation and Professional Simulation Suites are available now starting at $46,000.

Hewlett-Packard Company is a leading global manufacturer of computing, communications and measurement products and services recognized for excellence in quality and support. HP has 108,300 employees and had revenue of $31.5 billion in its 1995 fiscal year.

Information about HP and its products can be found on the World Wide Web at http://www.hp.com. Additional information on products from HP EEsof can be obtained on the World Wide Web at http:/www.hp.com/go/hpeesof. -0-

Note to Editor: UNIX is a registered trademark in the United States and other countries, licensed exclusively through X/Open(tm) Company Limited.

X/Open is a trademark of X/Open Company Limited in the UK and other countries.

Sales information may be obtained by calling 1-800-452-4844 ext. 1922. Please do NOT use editor-contact or corporate telephone numbers for sales information.

Information in this release applies specifically to products available in the United States. Product availability and specifications may vary in non-U.S. markets.

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CONTACT: Hewlett-Packard Company

Elisabeth Kannow, 818/879-6440

ekannow@hp.wlv.com

or

CM Communications for HP

Caroline Murphy, 415/324-8819

cpmurphy@aol.com