BE Semiconductor Industries Introduces Integration Services Division

Business Wire, July 18, 1997

ZEVENAAR, The Netherlands--(BUSINESS WIRE)--July 18, 1997--BE Semiconductor Industries NV (Nasdaq: BESIF; Amsterdam Stock Exchange: BESI; Frankfurt Stock Exchange: BSI) today announced the introduction of a new division for semiconductor assembly and test systems integration in its Fico subsidiary.

Headquartered in Phoenix, Arizona with the development center in The Netherlands, the new division will commence operations in the fourth quarter of 1997 and will report to Dr. Gjalt R. Smit, Vice President of the Company and Managing Director of Fico.

The primary focus of the new division will be assembly and test equipment, software, and consulting services. All major IC, Power IC, and Discrete package types will be covered, from leadframe- based plastic packaging to emerging Ball Grid Array (BGA) and Chip Scale Packaging (CSP) technologies.

Richard Blickman, President and Chief Executive Officer of BE Semiconductor Industries, commented, "Our customers and industry analysts indicate that integration will become the most rapidly growing segment of the assembly industry in the years ahead, citing an estimated compound annual growth rate above 20 percent. Over the past 5 years, BESI has successfully designed and implemented several leading integration projects together with major semiconductor manufacturers in North America, Europe, and Asia. This new division reflects BESI's commitment to the developing integration market. Our goal for the division is to become the preferred global partner for advanced integration of semiconductor assembly and test manufacturing systems."

BE Semiconductor Industries NV designs, develops, manufactures, markets and services molding, trim and form and selective plating and tin-lead plating equipment for the semiconductor industry's `back-end' assembly operations and provides leadframes and connector plating services to customers. The Company's customers consist primarily of leading US, European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors.

CONTACT: Richard W. Blickman

President and CEO

31-316-597-511

or

Dr. Gjalt R. Smit

Vice President

31-316-597-511

or

Michele Katz/Jessica Davis/

Libby Marshall

Morgen-Walke Associates

Press: Brian Maddox/Estelle Bieber

212-850-5600