Imperial Bank Funds Working Capital Loan for Unitive Electronics Inc

Business Wire, Dec 17, 1998

RESTON, Va.--(BUSINESS WIRE)--Dec. 17, 1998--Imperial Bank's Emerging Growth Division (EGD) recently closed a $2.5 million working capital loan for Unitive Electronics Inc., to assist the company in providing high-quality flip chip bumping services to the electronics industry, announced Stacy Carlson, a managing director of Imperial's EGD.

The loan will be used to help Unitive expand and enhance the existing base of state-of-the-art processing equipment currently installed in the company's advanced manufacturing facility, which includes a 10,000-square-foot Class 10 clean room. This world-class facility provides standard 100- and 250-micron-diameter wafer bumping services for all current wafer diameters, as well as emerging 300-mm-diameter wafers.

"Imperial is pleased to provide assistance to innovative companies like Unitive, which is dedicated to providing the next generation of technology in the electronics packaging industry," said Carlson. "As Unitive's technology advances and its customer base grows, Imperial hopes to continue to provide financial assistance and support to this relationship."

"The electronics packaging industry is undergoing a major infrastructure change and thanks to Imperial Bank's financial support, Unitive will be able to participate in this evolution," said Wayne C. Machon, president and chief executive officer of Unitive. "Our objective is to replace the current wirebonding method with our high-quality flip chip bumping services for the electronics industry."

Unitive Electronics is a merchant supplier of advanced semiconductor processing services, including wafer bumping, I/O redistribution and repassivation to the electronics packaging industry. The company is the exclusive licensee for the patented electroplating technologies developed by the non-profit electronics information technology research consortium MCNC, located in Research Triangle Park, N.C.

Unitive was formed to deploy MCNC's advanced packaging technology, flip chip, by developing a highly reliable and cost-effective industrial manufacturing process. For more information, contact Unitive at 888/286-7464 or on the Web at www.unitive.com.

With more than $5 billion in assets, Imperial Bank is one of the leading independent business banks in the West, offering a wide range of financial services tailored to corporate customers, entrepreneurs and professionals.

Imperial's Emerging Growth Division provides credit and financial services to young, growing technology companies. From offices located in Menlo Park, Calif. and San Diego; Boston; Austin, Texas; Reston, Va.; and Bellevue, Wash., Imperial serves all major technology centers nationwide. Imperial Bank, which is the principal subsidiary of Imperial Bancorp (NYSE:IMP), can be found on the Web at www.imperialbank.com.