Sun Delivers First Four-Way Embedded SPARC Multiprocessor Board Designed for Telco and Networking OEMs

Business Wire, July 6, 1998

SAN JOSE, Calif.--(BUSINESS WIRE)--July 6, 1998--

Ultra AXmp Board Provides Three Times Compute Density as Comparable Office Systems

Sun Microsystems, Inc. today introduced the SPARCengine(TM) Ultra(TM) AXmp, a board-level solution, that uniquely enables Original Equipment Manufacturers (OEMs) to develop high performance, four-way multiprocessing embedded systems based on the SPARC(TM) processor and Solaris(TM) operating environment combination.

Applications benefiting from this technology range from NEBS compliant telecom adjunct servers to airport security scanners. The SPARCengine Ultra AXmp board enables OEMs to create innovative embedded systems with unparalleled computing power in one-third the space of traditional servers.

"A key obstacle in embedded computing is the efficient use of space," said Marge Breya, director of corporate marketing, Sun Microsystems' Microelectronics Division. "By giving customers the benefit of three times the compute density combined with the proven performance of Sun's leading multiprocessor technology and an innovative modular design approach, Sun has created an ideal solution for embedded computing."

Prior to this new technology from Sun, customers needing robust multiprocessor performance for deeply embedded industrial applications were often forced to retrofit traditional servers originally designed for use in the office enterprise versus the harsh environment of embedded computing. The results of this mismatch ranged from excessive use of central office rack mount space to limited overall integration flexibility.

"Our new Ultra AXmp technology was designed specifically to meet the compute density and integration needs of OEMs requiring full-featured, robust, reliable solutions," said Breya. "Our new products allow OEMs flexibility in the design of their systems and they can now bring applications to the embedded compute market that were not possible before due to space or reliability concerns."

Compute Core Technology Improves Compute Density

The Ultra AXmp board is the first in a line of flexible, compact and rugged products that use Sun's new Compute Core Technology (CCT); an innovative modular approach to designing boards for high-performance, multiprocessing (MP) embedded compute applications.

The Ultra AXmp board's Compute Core Technology leverages Sun's expertise in developing high performance, scalable servers and is the key to this revolutionary approach. By partitioning the core components of Sun's four-way architecture in a dense and modular package, Sun enables unprecedented compute density and integration flexibility to meet the diverse needs of the embedded market.

The Ultra AXmp motherboard is designed to be deployed in an industrial, rack mount chassis in either a horizontal or vertical orientation. This allows customers an easy upgrade to faster processors and flexibility in selecting various I/O cards. The Ultra AXmp board fits comfortably in a standard 5U high chassis or in a custom chassis as small as 4U.

Rack deployment also allows OEMs to offer space conscious solutions when space is at a premium as demonstrated by ISP server applications co-located in telco central offices. As many as 10 Ultra AXmp boards can be placed in a single 19-inch rack cabinet, which is three times the number when compared to office systems. These compact dimensions give OEMs the flexibility to design systems that meet their packaging needs and meet the highest performance requirements.

By leveraging the PCI infrastructure, Sun enables OEMs to shorten new product development cycles as well as lower overall system costs with less expensive peripherals. In addition to PCI, Sun plans to leverage its Compute Core Technology to support other industry standard busses including compactPCI.

Superior Multiprocessing Boosts Compute and I/O Performance

With the Ultra AXmp solution, Sun is leveraging its proven multiprocessing server technology. A key feature of this technology is Sun's Ultra Port Architecture(TM)(UPA) system design, which enables the aggregate CPU bus bandwidth to be increased to 3.2 GBytes per second (three times that of a traditional MP system), via a custom cross bar switch.

This large processor bandwidth enables scaling of up to four UltraSPARC -II(TM) s-series microprocessor modules (currently shipping at 250, 300 and 360MHz).

The Ultra AXmp motherboard has six 64-bit high-performance PCI slots, four at 33 MHz and two at 66MHz. Using four peer PCI busses, the I/O bandwidth expands to more than four times that of comparable alternative platforms.

Webtone Reliability Delivered By the SPARC and Solaris Combination

The Ultra AXmp board is an example of Sun delivering Webtone enabling technology to OEMs. Webtone describes Sun's vision of delivering network computing functionality and performance with the reliability and functionality associated with everyday dialtone. If an OEM designs a system to act as an ISP host using other microprocessor and operating system technologies they may not have same Webtone reliability as the SPARC and Solaris operating environment combination.