Microsemi Corp. Awarded Patent For Hermetic Surface Mount Packaging; Designed to Save Weight and Space in Military and Aerospace Applications

Business Wire, August 25, 1999

SANTA ANA, Calif.--(BUSINESS WIRE)--Aug. 25, 1999--

Microsemi Corp. (Nasdaq:MSCC) announced Tuesday that it has received U.S. Patent No. 5923083 for hermetic packaging technology for two-terminal solderable silicon die, such as Schottky rectifiers.

Microsemi's new technology was developed to reduce cost, weight, improve long-term reliability, and increase the power-handling capability of surface mount semiconductors used in military and aerospace applications.

Marketed as ThinKey(TM) components, the advanced packaging was originally designed to create "thin" Schottky devices. The technology is unique in that it bonds metal pads directly to both sides of the silicon die with a ceramic seal frame. This eliminates conventional wire bonds that can limit surge capacity and reduce device reliability after prolonged operation.

With no intermediate straps or wires, the die actually becomes part of the final package. This unique packaging concept also allows designers to change polarities simply by flipping the part over.

"Customer reaction to our ThinKey packaging concept has been extremely positive," said Manuel Lynch, worldwide marketing director at Microsemi. "So now we're offering it in multiple configurations, providing a wider range of power rating options in our military and aerospace rectifier, Schottky and transient-voltage-suppression devices," he said.

The U.S. patent credits Tracy Autry, Fernando Lynch and Dan Tulbure as inventors of the advanced packaging, which was developed at Microsemi's Santa Ana facilities.

"This patent award confirms that Microsemi is still the world's leading supplier and product developer of high-reliability components," commented Lane Jorgensen, vice president and general manager of the Military/Space Division. "We've already developed four new device types based on this patented technology during the past year."

Microsemi is a global supplier of high-reliability and commercial analog integrated circuits and power and signal discrete semiconductors for the satellite, telecommunications, computer and peripherals, military/aerospace, industrial/commercial, and medical markets.

More information may be obtained by contacting the company directly or by visiting its Web site at http://www.microsemi.com.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not historical in nature are forward-looking statements. Forward-looking statements are inherently subject to risks and uncertainties, some of which cannot be predicted or quantified. Potential risks and uncertainties include, but are not limited to, such factors as the difficulties regarding hiring qualified technical personnel in a competitive labor market, rapidly changing technology and product obsolescence, the strength and competitive pricing environment of the semiconductor marketplace, demand for and acceptance of the company's products, the success of planned marketing and promotional campaigns, realization of backlog, business and economic conditions such as the current industry conditions, customer order preferences, company strategies, environmental matters, litigation, inventory obsolescence, and the factors mentioned elsewhere in this news release, as well as other factors identified in the company's most recent Form 10-K and subsequent Forms 10-Q filed by the company with the Securities and Exchange Commission. -0-

NOTE TO EDITORS: Forward reader inquiries to Microsemi Marketing Communications, 11861 Western Ave., Garden Grove, Calif. 92841-2119.

Investor inquiries: David R. Sonksen, Microsemi Corp., Santa Ana, Calif., 714/979-8220; or Sean Collins or William F. Coffin, Coffin Communications, Sherman Oaks, Calif., 818/789-0100.