Dense-pac Microsystems Expands Investor Relation's Program With the Hiring of Wall Street Investor Relations Corp

Business Wire, June 10, 1999

GARDEN GROVE, Calif.--(BUSINESS WIRE)--June 10, 1999--

-- Wall Street Investor Relations Corp. is hired to

strategically focus the Dense-Pac story to institutions and

retail investors.

-- Goal is developed to enhance shareholder value by

communicating Dense-Pac's current and new patented technologies

and the current successes at the Company.

Dense-Pac Microsystems, Inc. (Nasdaq:DPAC), a leading edge provider of high density semiconductor packaging solutions, announced today that it has retained Wall Street Investor Relations Corp. for the expansion of its investor relation program.

Wall Street Investor Relations, headquartered in Washington, D.C. area, is a recently formed full service investor relations firm, comprised of brokerage industry professionals. The firm focuses primarily on technology sector companies of micro to mid-capitalization.

Per Ted Bruce, CEO of Dense-Pac Microsystems, "Dense-Pac is now taking the next step in disseminating our story to the investment community. We chose Wall Street Investor Relations because of their understandings of the investment process from the sales, trading, research and investment banking sides. Wall Street Investor Relations understands the strategy of Dense-Pac and will help us disseminate our story to a receptive audience of both retail and institutional investors."

Joe Zapulla, Managing Director of Wall Street Investor Relations, added, "I was originally introduced to Dense-Pac by a couple of investors who asked my opinion on the Company's market valuation. I was impressed with the Company's new focus on growth and valuations, its new management team, and its current prospects, which do not appear to be reflected in its valuations. I look forward to working with a company with such a strong investment theme."

Dense-Pac Microsystems, Inc. is a technology company that specializes in the design of proprietary and patented three-dimensional high-density packaging. The products allow the company's commercial, industrial, defense and aerospace customers to pack large amounts of memory into small spaces. Its commercial products include applications such as network servers, computers storage devices and medical instrumentation. IDA can include airborne and space avionics and such diverse areas as space satellites and missiles and high performance servers. The Company web site is at www.dense-pac.com.

The above statements are forward looking statements and projections based on management's belief as well as assumptions. There can be no assurances that the Company's goals will be realized. Numerous factors may affect the Company's actual results and may cause results to differ materially. Some of those factors include, without limitation, demand and acceptance of new and existing products, ability to manage large projects, the ability to attract and retain key employees, technological and product obsolescence, availability of semiconductor devices at reasonable prices, competitive factors, costs and uncertainties of litigation and the availability of capital to finance growth and working capital needs. These and other risks are discussed in greater detail in the Company's 10-KSB, 10-QSB, or 8-K filings with the Securities and Exchange Commission.