Intel and Via Reach Settlement in Patent and Contract Litigation

Business Wire, July 5, 2000

Business Editors and High-Tech/Legal Writers

SANTA CLARA, Calif.--(BUSINESS WIRE)--July 5, 2000

Intel Corporation and Via Technologies, Inc. today jointly announced that the companies have reached settlement of pending litigation related to a cross license between the two companies. The dispute arose out of a 1998 license agreement between the two companies. The settlement will result in the dismissal of patent infringement suits filed in the High Court of Justice in the United Kingdom, the High Court of the Republic of Singapore and before the U.S. International Trade Commission. Additionally, a suit on this matter pending in U.S. District Court in San Francisco will be amended to eliminate breach of contract claims and patent claims for chipsets that support Intel microprocessors.

Under terms of the settlement, Via will pay Intel a lump sum along with ongoing royalty fees. In addition, Intel has agreed to modify the 1998 license agreement in order to reflect current market and business conditions. Under the modified agreement, Via is licensed under Intel patents to produce certain P5 and P6 chipsets. The remaining terms of the settlement are confidential.

This settlement does not affect the litigation pending in U.S. District Court in San Francisco currently related to chipsets that do not support Intel processors.

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