SpeedFam-IPEC Momentum CMP Tool Now in Full Production At LSI Logic; Leading ASIC Device Manufacturer Expands Oxide Applications With Momentum Orbital Hard-Platen Technology

Business Wire, Nov 5, 2001

Business Editors

CHANDLER, Ariz.--(BUSINESS WIRE)--Nov. 5, 2001

SpeedFam-IPEC, Inc. (NASDAQ:SFAM), a global supplier of leading-edge chemical mechanical planarization (CMP) systems for advanced semiconductor manufacturing, has announced that its Momentum(TM) CMP tool is in full production at LSI Logic Corporation's Gresham, Ore., location. LSI is using the orbital hard-platen system for dielectric CMP applications at its 0.18- and 0.13-micron technology nodes.

With nearly 20 Momentum-based CMP tools currently on order or installed at fabs and foundries in the United States, Europe and Asia, the system in production at LSI Gresham is the first customer implementation of orbital hard-platen polishing technology.

"Collaboration with LSI was key to the successful development of our beta Momentum product," said SpeedFam-IPEC President and CEO Richard J. Faubert. "As a manufacturer of complex ASIC devices, LSI provided critical ongoing feedback during the beta process, as we fine-tuned Momentum's yield-enhancing features."

Semiconductor International named the Momentum system Grand Award winner in the magazine's annual Editors' Choice best product competition based on nomination information from LSI Logic and fulfillment of numerous performance-based criteria. LSI is utilizing SpeedFam-IPEC's process of record for inter-level dielectric (ILD) and other dielectric planarization applications.

"As an early adopter of orbital hard-platen technology, LSI understood the productivity-enhancing potential of Momentum," Faubert added. "Now in production, LSI is realizing yield advantages based on Momentum's unique total wafer metrics control capability."

Norm Armour, vice president and general manager of LSI Logic Gresham Operations, said, "When it comes to advanced device manufacturing today, productivity is the bottom line. For LSI Logic, Momentum's innovative multi-zone carrier has enabled us to optimize the CMP process for our vast family of ASIC devices in terms of post-range and removal uniformity. This precision control and the proprietary pressure optimization software have been instrumental in compensating for the deposition non-uniformity of the CVD dielectric reactors through zoned optimization across the wafer, resulting in improved production yields."

LSI Logic Corporation

LSI Logic Corporation (NYSE: LSI) is a leading designer and manufacturer of communications, consumer and storage semiconductors for applications that access, interconnect and store data, voice and video. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered in Milpitas, Calif. The company's website URL is http://www.lsilogic.com.

SpeedFam-IPEC, Inc.

SpeedFam-IPEC, Inc. is a pioneer and innovator in the manufacture of chemical mechanical planarization (CMP) systems used in the fabrication of advanced semiconductor devices. With an extensive worldwide installed base, the company enables the development of next-generation integrated circuit technology through its leading-edge polishing systems. SpeedFam-IPEC also markets and distributes parts used in CMP and precision surface processing. With headquarters in Chandler, Ariz., and offices throughout the world, SpeedFam-IPEC is publicly traded on NASDAQ under the symbol SFAM. The company's website URL is www.sfamipec.com.

This news release contains forward-looking statements related to our Momentum(TM) product. Actual results may vary. Although initial customer reaction to Momentum has been positive, sales of Momentum may not occur on the scale or in the time frame we anticipate. For instance, roll-out of Momentum tools may be slowed due to manufacturing problems, unforeseen technical problems with Momentum technology or changes in the CMP marketplace that differ from our expectations. Current market conditions in the semiconductor industry may cause potential purchasers of Momentum to delay investment in new equipment or cancel orders. See SpeedFam-IPEC's filings with the SEC, including the Annual Report on Form 10-K filed on Aug. 24, 2001 and the Quarterly Report on Form 10-Q filed on Oct. 11, 2001, for additional risks affecting the company.