Tru-Si Technologies Penetrates Southeast Asia Market With Dry Etch System Order; Order From Leading U.S. Semiconductor Maker Slated for New Thin-Wafer Process Line in Pacific Rim

Business Wire, Oct 30, 2001

Business Editors/High-Tech Writers

SUNNYVALE, Calif.--(BUSINESS WIRE)--Oct. 30, 2001

Tru-Si Technologies today announced that it has secured an order for its proprietary atmospheric downstream plasma (ADP) chemical dry etch equipment from a major U.S. semiconductor manufacturer, for installation in that firm's Southeast Asia facility. Scheduled for delivery in the fourth quarter of 2001, the ADP system, which incorporates Tru-Si's innovative NoTouch(TM) wafer handling technology, will be used in a new 8-inch wafer thinning operation, and represents Tru-Si's first installation in the expanding Southeast Asia region.

The order reflects a growing trend toward the use of fully automated dry etch technology for demanding damage- and stress-free applications associated with wafer thinning below 200 microns. Increasingly, ultra-thin wafers and die are used for the advanced packaging applications needed for wireless or handheld consumer electronics.

Tru-Si Chief Executive Officer Dr. Sergey Savastiouk said, "We are very pleased to receive this order, which broadens the global market acceptance of our breakthrough technology. But more importantly, we are gratified that this customer has selected Tru-Si to support its efforts to achieve more productive wafer thinning operations.

"Tru-Si has already engaged with this customer in active development of advanced packaging solutions involving the use of Tru-Si's ADP etch and Thru-Silicon(TM) interconnect technologies," he added. "We now look forward to extending that collaboration to resolve complex issues of stress and damage removal and automated handling."

About the Company

Headquartered in California's Silicon Valley, privately held Tru-Si Technologies serves the global semiconductor industry with innovative solutions for damage-free wafer thinning, ultra-thin wafer handling and new chip-to-chip interconnection structures. The company's proprietary technologies for atmospheric downstream plasma (ADP) chemical dry etching and NoTouch handling, along with revolutionary through-silicon applications, enable semiconductor manufacturers to meet burgeoning demand for smaller, thinner, cheaper and more functional devices used in wireless, portable, smart-card, networking and Internet applications. Tru-Si's technology is used by leading chipmakers in some of the world's first high-volume ultra-thin wafer production lines. For more information about Tru-Si, visit the company online at www.trusi.com.

Note to Editors: NoTouch and Thru-Silicon are trademarks of Tru-Si Technologies.