Business Services Industry

Multimedia Available: Applied Materials Enters 300mm Wet Clean Market with Revolutionary New Oasis System

Business Wire, June 19, 2002

Business Editors/High-Tech Writers

ADVISORY...for Wednesday (June 19)

NOTE TO EDITORS: Multimedia Assets Available With This Story

Include Logos, Photos, Text News Releases

--(BUSINESS WIRE)

Applied Materials, Inc. brings major advancements in technology and production efficiency to semiconductor wafer cleaning with its new 300mm single-wafer Oasis Clean(TM) system. Replacing traditional batch wet benches, the Oasis Clean offers new technology for the nearly 50 critical cleaning steps needed to fabricate the transistor area of the chip while providing customers with the significantly faster production cycle time and particle removal performance necessary for nanometer chip manufacturing.

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COPYRIGHT 2002 Business Wire
COPYRIGHT 2008 Gale, Cengage Learning

 

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