Palomar Technologies' Automatic Wire Bonder Combines Precision and the Industry's Largest Bonding Area

Business Wire, Nov 1, 2002

Business Editors/High-Tech Writers

VISTA, Calif.--(BUSINESS WIRE)--Nov. 1, 2002

Automates Wedge Bonding Over 600 Square Inches With 0.00025" Accuracy

Palomar Technologies, the leading manufacturer of automated, high-precision assembly systems, announced the availability of its 3470-II automatic wire bonder for high performance, first-level, gold or aluminum wire interconnect assembly used in military and aerospace applications.

The 3470-II enables deep access wedge bonds across the industry's largest bonding area, 633 square inches (16.0782 square meters), with 0.00025 inch (0.00635mm) accuracy and exceptional control and repeatability for bonding complex parts such as compact hybrids, MCM power connections, microwave devices and microwave tuning.

The 3470-II performs ultrasonic or thermosonic wedge bonding using an optional heated work stage. The X-Y robotic positioners can move to any position within a 32.5" x 19.5" (825.5mm x 495.3mm) bonding envelope, accommodating both large and small microcircuit substrates and packages. The bonder provides precise loops and wire control over a large range of wire and ribbon sizes, from 0.7 mil diameter gold wire to 1 x 10 mil ribbon. The dual mode ultrasonics provides over 100 discrete programmable power levels for adjustment to variations in bonding surfaces. Palomar's unique clamping and terminating process allows for deeper access into "high-walled" packages.

Palomar's 3470-II has generated interest in the defense and satellite industries where bonding on large surface area assemblies is required. A long supporter of the defense industry, Palomar Technologies began in 1995 as a spin-off of Hughes Aircraft's Test and Assembly division. Today, Palomar/Hughes die and wire bonders are used extensively around the world in support of telecom, defense, satellite, medical, automotive and other semiconductor industries.

About Palomar Technologies

Palomar Technologies provides complete process and equipment solutions for precision automated assembly of optical, RF and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace and medical industries. Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices. Equipment solutions range from islands of automation to complete integrated assembly lines of dispensers, placement stations, ovens, cleaners, and wire bonders with automatic handling between process stations. Palomar Technologies won the 2001 Advanced Packaging Award, Fiberoptic Product News 2001 Technology Award, and the Microwaves & RF Top Products of 2001 award for its innovative products and technology. Visit our Web site at www.palomartechnologies.com or contact us at 760/931-3600. Palomar Technologies, "Enabling Lightwave Connectivity."

Editors: Digital photos are available through tmcgough@bonders.com.