BTU International to Present at Needham & Company Growth Conference; Wednesday, January 12, 2005, 3:30 p.m. ET

Business Wire, Dec 21, 2004

NORTH BILLERICA, Mass. -- BTU International, Inc. (Nasdaq NM: BTUI), the leading supplier of advanced thermal processing equipment used for printed circuit board assembly, semiconductor packaging and advanced materials processing, today announced that it will be presenting at the Seventh Annual Needham Growth Conference at The New York Palace Hotel in New York, NY, on Wednesday, January 12, 2005, at 3:30 p.m. ET.

Presenting for BTU will be Paul J. van der Wansem, chairman and CEO. The presentation also will be webcast over the Internet. To access the webcast, please go to the BTU website at www.btu.com or to http://wsw.com/webcast/needham10/btui/ . An archive of the presentation will be available shortly after the conclusion of the live presentation and will be accessible for approximately two weeks.

For more information about the conference, please contact your Needham & Company representative, directly.

About BTU International

BTU International is a market-leading supplier of advanced thermal processing equipment to the semiconductor, electronics, and materials sectors. BTU manufactures a wide range of equipment for semiconductor packaging applications, including state-of-the-art systems for wafer bumping and wafer-level packaging. The company is also a major manufacturer of solder reflow furnaces for printed circuit board assembly, and advanced systems for materials processing applications requiring high temperatures and precise atmosphere control. BTU, with world headquarters in North Billerica, Mass., operates worldwide with direct sales and service offices in the USA, Asia and Europe. Information about BTU International is available on BTU's website at www.btu.com.