Matrix Semiconductor and System General Team for Programming Solutions; Efforts Bring Higher Memory Density, Quick Turnaround, and Competitive Pricing to Market

Business Wire, Oct 18, 2004

SANTA CLARA, Calif. -- Matrix Semiconductor, Inc. -- a developer of high-density, low-cost, three-dimensional semiconductors -- today announced that it is working with System General to develop content programming solutions for Matrix(R) 3-D Memory (3DM). Equipped with proprietary mapping technologies, System General's T9600 programmer follows Matrix's stringent quality specifications while programming the memory devices at the fastest speed possible. Together, Matrix and System General help digital content publishers accelerate their time-to-market for delivering their properties to the mobile phone, handheld computing, toy, and game console industries.

The testing capabilities on the T9600 provide high/low margin verifications and other post-programming tests on Matrix(R) 3DM. This ensures the highest reliability for content stored on Matrix 3DM components before they reach their target customer's systems. This joint effort develops approved programming solutions for both mass production and engineering applications. System General works directly with Matrix Semiconductor as the technical liaison and provides sales/technical support for customers in the U.S.

"System General will be working with Matrix to provide a proven solution for programming Matrix 3-D Memory quickly, reliably, and affordably," noted Dan Steere, vice president sales and marketing, Matrix Semiconductor. "Customers are constantly looking to program larger amounts of memory at the lowest costs. By utilizing System General we are able to deliver programmed, high-density, low-cost memory devices on a quick-turnaround basis for our customers."

System General has long been known for providing total solutions to fit customers' programming needs. For mass production, System General integrates the 9600 programmers with automated pick-and-place handlers for automatic programming operation. Socket adapters with two or four sockets are available to increase the programming sites and throughput.

"When you have 512-megabit or larger devices to program, the costs of device programming would represent a significant portion of your overall device cost," said Don Yang, vice president System General. "Our engineering team constantly works with Matrix to optimize programming and verification algorithms so that the programming costs will be the lowest for its customers."

Matrix 3DM is an inexpensive, high-capacity, permanent, non-volatile memory and the first product based on Matrix Semiconductor's technology innovations. By designing memory chips in three dimensions, Matrix Semiconductor is uniquely able to maximize the use of silicon and, therefore, achieve extremely low cost for memory products.

System General has corporate facilities in Taiwan (Headquarters), USA, China and Korea. Located in the center of Silicon Valley, the U.S. branch is in Milpitas, California. Technical support for manufacturing facilities in the Asia Pacific arena, are facilitated by their proximity to System General's Taiwan headquarters and branch offices in China and Korea.

About Matrix Semiconductor

Founded in 1998, Matrix Semiconductor, Inc. (Santa Clara, Calif.) has developed the means to create three-dimensional semiconductors using standard manufacturing techniques and materials. By optimizing use of a semiconductor wafer's area -- building "up" rather than "out" -- Matrix's 3-D technology produces highly dense chips at much lower costs than existing technologies. Matrix's first product, Matrix(R) 3-D Memory (3DM), is a low cost, high density, non-volatile memory compatible with existing standards and targeted for use in millions of portable electronic devices. More information is available at http://www.matrixsemi.com.