SBS Technologies Introduces Fibre Channel AdvancedMC Host Bus Adapter to Its Telum AdvancedMC Portfolio

Business Wire, June 7, 2005

CHICAGO -- SBS Technologies(R) (Nasdaq:SBSE)

Telum(TM) FC2312-FF and FC2312-CC HBAs bring Fibre Channel connectivity to AdvancedTCA(R) platform applications

--x4 PCI Express interface

--On-board programmable protocol engine

--Full Hot Swap support

--IPMI controller

Today at SuperComm 2005, SBS Technologies(R) (Nasdaq:SBSE), a leading provider of one of the broadest lines of data and communication mezzanine modules in the embedded telecommunications industry, announced two Advanced Mezzanine Card (AdvancedMC(TM)) Fibre Channel Host Bus Adapter (HBA) modules -- the new Telum FC2312-FF optical fiber-to-optical-fiber and Telum FC2312-CC copper-to-copper HBAs. The single-wide, full-height FF2312 HBAs are compliant with PICMG(R)'s AMC.0 specification for AdvancedMC.

These 2 Gb/s Fibre Channel cards provide connectivity to a x4 PCI Express host board and are available with either dual copper or dual optical fiber interfaces. The Telum FC2312-FF and -CC are designed to take full advantage of industry standard Fibre Channel features and benefits. With high sustained throughput and low latency they are ideal for host-to-storage applications. Arbitrated loop, point-to-point, and switched network topologies are supported.

"The FC2312 AdvancedMC HBAs, together with supporting software tools, provide the high sustained throughput and low latency required for demanding real-time and storage applications," said Bill Molyneux, Vice President and General Manager of SBS General Purpose I/O Products. "SBS offers a wide variety of Fibre Channel HBAs to meet customers' demanding application requirements. Engineers designing AdvancedMC boards into their systems can count on SBS quality, reliability, and availability in a range of existing and future AdvancedMC products."

Designed to take full advantage of industry standard Fibre Channel features and benefits, SBS AdvancedMC HBAs incorporate an onboard programmable protocol engine that minimizes host CPU intervention, provide full Hot Swap support, and have auto-negotiation of link speed (1 Gb/s or 2 Gb/s). Dual independent channels support concurrent operating nodes. Also, 200 MB/s half-duplex and 400 MB/s full-duplex sustained transfer rates are supported. SCSI Initiator, raw SCSI, file system, and IP protocol support are provided for selected operating systems. Device drivers for Windows(R), Solaris(R) and Linux(R) operating systems are available from QLogic(R).

Price and Availability:

Available now, OEM pricing for the Telum FC2312-FF is US$1,150. OEM pricing for the Telum FC2312-CC is US$1,320.

About SBS Technologies(R)

SBS Technologies, Inc. (Nasdaq:SBSE) founded in 1986, designs and builds a wide range of standard and customized embedded computer products. Our products include processor boards, input/output modules, networking devices, and complete computer systems. Our products are used in many industries, including telecommunications, medical electronics, industrial automation and defense. Headquartered in Albuquerque, New Mexico, SBS maintains eight primary operating locations, has regional sales offices throughout the United States and has international sales and support offices in six countries. More information on SBS is available at www.sbs.com.

Brand or product names are registered trademarks or trademarks of their respective holders.

This new product announcement contains forward-looking statements concerning SBS Technologies, Inc.'s product strategy, technology capability, competitive leadership, including product breadth, product capabilities, and future product introductions. These statements reflect the perspectives and expectations of SBS management as of the date of this release. Actual results may differ materially from those projected or implied in these forward-looking statements as a result of a number of risk factors, including sales and product strategy within SBS; research and development successes in developing AdvancedMC processor modules for Advanced TCA; timing of new product introductions; allocation of research and development efforts within SBS; the impact of rapid technological and market change; and other risk factors listed from time to time in the SBS SEC reports, including those listed under "Risk Factors" in the SBS Annual Report on Form 10-K and other reports.