Oxford Semiconductor Appoints CEO to Drive Expansion

Business Wire, March 15, 2005

OXFORD, England -- Oxford Semiconductor has announced the appointment of William Mackenzie as its new Chief Executive Officer. Mackenzie will be responsible for driving forward the company's global expansion plans and will establish a new headquarters for the company in the USA.

"Oxford Semiconductor has achieved substantial and consistent sales growth over the last five years, and it's the right time to start the next phase of the company's development. We have strategically important customers and technology partners based in the USA and strengthening our local presence there is a priority," said Mackenzie.

He continued, "Oxford Semiconductor has assembled an incredible team of hardware and software experts at its UK office, and it's through them that the company has been able to innovate and maintain its market leadership in bridge chip technology. The UK design center near Oxford will remain the technology hub of the company."

Mackenzie arrives at Oxford Semiconductor from Centillium Communications, where he was Vice President of Operations, Manufacturing and Human Resources. Joining the company at an early stage, Mackenzie spent seven years building Centillium's manufacturing capability and infrastructure to enable it to become one of the world's fastest growing semiconductor companies. He previously spent eight years with LSI Logic, based in Canada and the United States, in executive management and engineering roles and four years with Motorola Semiconductors in Scotland.

Oxford Semiconductor designs and manufactures communication bridge ICs and is the world leader in external FireWire storage solutions. A leading exponent of FireWire audio, the company has played a key role in taking pro-quality sound into the consumer mainstream. A world first, its recently announced USB to SATA bridge chip is enabling the next evolution in external storage.