Micron Technology, Inc., Announces Availability of FBDIMM Memory Modules for Servers, Workstations and Networking Equipment

Business Wire, April 10, 2006

BOISE, Idaho -- Micron Technology, Inc., (NYSE:MU), a worldwide provider of advanced memory and image sensor solutions, today announced the production availability of its DDR2 fully buffered dual in-line memory module (FBDIMM) solutions. Validated in coordination with Intel Corporation, Micron's FBDIMMs provide new advanced channel features that vastly improve performance in high-speed, high-density applications such as servers, workstations and networking equipment.

Micron's FBDIMMs are available in densities from 512 megabyte (MB) to 4 gigabyte (GB) and speed grades extending to PC2-5300. Micron's FBDIMMs have received validation by Intel (please refer to http://www.intel.com/technology/memory/FBDIMM/ddr2_fbdimm.htm). For more information about Micron's FBDIMM products, visit www.micron.com/fbdimm.> "JEDEC and Intel jointly developed the FBDIMM specification to address the demands for higher system performance, and Micron actively supported this important effort from its inception," said Jan du Preez, Micron vice president of memory marketing. "Micron is extremely pleased to offer this exciting new technology to customers as a result of an outstanding and well-executed effort. FBDIMM technology is instrumental in increasing the bandwidth and memory capacity in new server and workstation platforms."

Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND Flash memory, CMOS image sensors, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

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