Teradyne's microFLEX Selected by Infineon Technologies as Exclusive Test System for Automotive Power ICs

Business Wire, April 3, 2006

BOSTON -- Teradyne, Inc. (NYSE: TER) announced that it has been selected to supply its microFLEX(TM) test system as the designated automotive power IC test system to Infineon Technologies AG (FSE/NYSE: IFX), one of the world's leading suppliers of integrated circuits (IC). In an agreement spanning four years, Teradyne will be the single automotive power IC device test equipment supplier for Infineon worldwide, including their new large capacity wafer production facility in Kulim High tech Park, Malaysia. The microFLEX systems will be used for engineering and production test of current and next-generation automotive power ICs (e.g. highly complex chips for anti-lock braking systems). In a competitive selection process, Infineon chose Teradyne for its dependable quality of test, global customer support expertise, and low cost of test. Infineon is a longstanding European customer of Teradyne and currently has multiple FLEX(TM) test systems installed in production.

"Quality has top priority for Infineon and zero-defect products are the goal to which we are committed," said Ahmad Abde-Yazdani, Director, Test Development, Infineon Technologies. "We optimize our development, production and testing processes on an ongoing basis toward achieving this goal. Infineon selected the microFLEX system because of its superior technical alignment with our automotive test requirements."

"Infineon is a market leader in automotive power ICs that require the full breadth of high voltage and high power instrumentation that the microFLEX system delivers," said Regan Mills, General Manager, Teradyne(R) Semiconductor Test Consumer Business Unit. "The FLEX Platform architecture is unique in its ability to deliver the broad test capability required to meet zero defect quality targets, while achieving the low cost-of-test that is fundamental for the highly competitive automotive power market segment."

About the FLEX Platform

The Teradyne FLEX Test Platform advances test technologies in an architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SOC) and System-In-Package (SIP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL(TM) software operating system provides fast program development, including instant conversion from single to multi-site test. And, the OpenFLEX(TM) open system architecture complements the FLEX Platform's broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.> Further information on Infineon Technologies is available at www.infineon.com.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2005, Teradyne had sales of $1.08 billion, and currently employs about 4,000 people worldwide. For more information, visit www.teradyne.com. Teradyne(R), FLEX, microFLEX, IG-XL, and OpenFLEX are trademarks or registered trademarks of Teradyne, Inc. in the US and other countries.