Oxford Semiconductor Receives Best Connectivity Technology Award; Award Recognizes Oxford's Innovation in Connectivity Solutions for Embedded Systems

Business Wire, Jan 5, 2006

MILPITAS, Calif. -- Oxford Semiconductor, Inc., a leading provider of high performance connectivity solutions for consumer, storage, and multimedia applications, today announced that it was presented the Best Digital Portable Connectivity Semiconductor Technology award for its connectivity solutions. The award was announced at the 2005 Digital Portable Technology Summit held on November 23 in Shanghai, China.

The award was presented to Oxford Semiconductor at the annual event, which is organized by ChinaECNet and China InfoWorld. Award winners were selected by a readers' poll survey jointly conducted with China InfoWorld.

"Oxford was selected for this award by an audience of its peers," said ChinaECNet CEO, Dr. Wayne Chao. "Our membership consists of 250,000 members in the high technology and semiconductor manufacturing arenas. We were pleased to present this award to Oxford Semiconductor as they ranked very highly among our audience and have proven solutions that enable high performance connectivity that can be implemented quickly and easily."

The Digital Portable Device Summit is intended to provide a comprehensive and comparative venue where digital portable device IC suppliers can present their technology and manufacturers can compare. ChinaECNet selected 300 consumer electronic engineers from its 250,000 members to attend the technology summit onsite, and an estimated 2,000 members attended online for the series of presentations made by speakers from major electronic IC suppliers. The presentations were broadcast in real-time nationwide in China. Oxford Semiconductor's presentation, titled "USB Connectivity Solutions for the Portable Digital Devices," was delivered by the company's product marketing director, Paul Liu.

About Oxford Semiconductor

Oxford Semiconductor designs and markets high performance connectivity controllers for the storage, multimedia communication, computing, and industrial markets. Founded in 1992, Oxford is a privately owned company headquartered in Milpitas, California. Oxford recently acquired TransDimension, a fabless semiconductor company based in Irvine, Calif. TransDimension provides USB connectivity solutions and software for embedded applications.

As the market leader in IEEE1394 (FireWire) and USB interface controllers for direct attached storage applications, Oxford Semiconductor has shipped more than 10 million devices, and today supplies all of the world's major external storage manufacturers.

Oxford Semiconductor also has a strong reputation in high speed serial communication chips, and offers complete solutions for bridging between a wide range of standard computer interfaces. Through its FireWire audio controllers, Oxford Semiconductor has led the development of breakout boxes, external sound cards and multi-channel speaker systems, providing laptop users with quality sound for the very first time. More information about Oxford Semiconductor can be found at http://www.oxsemi.com.