Top Industry Executives Explore Broadband and Mobility Trends During IEC Executive Forum at GLOBALCOMM 2006

Business Wire, March 16, 2006

ARLINGTON, Va. -- Mobility Trends Highlighted Throughout GLOBALCOMM(TM) Educational Programming and Exhibit Floor

The International Engineering Consortium (IEC) and the Telecommunications Industry Association (TIA), owner and organizer of GLOBALCOMM(TM), today announced that mobility and broadband will take center stage during the IEC Executive and Communications Forums and throughout GLOBALCOMM.

GLOBALCOMM, the next-generation communications marketplace and summit, will be held June 4-8, 2006, at Chicago's McCormick Place. For TIA, GLOBALCOMM replaces SUPERCOMM(R) as TIA's annual industry event.

The IEC Executive Forum will feature a stellar line-up of executives from ArrayComm, Motorola, AT&T, Telefonica, IBM, Alcatel, DT and more, sharing their insight on mobility content during two days of workshops. Featured IEC Executive Forum Workshops include: Mobility and Wireline Convergence: Merger or Collision; The Digital Home: Gateway to Opportunity; and IPTV: The Real Story.

The IEC Communications Forums serve the industry though a series of 90-minute sessions covering the world of communications. Key sessions planned for the forums include:

Monday, June 5

--"Mobility & Wireline Convergence: Merger or Collision"

--"IPTV Ecosystem: End-to-End View on Delivering the End-User Experience"

--"Fixed-Mobile Convergence: Ask Questions First"

Tuesday, June 6

--"Broadband & Mobility Content & Services: Don't Be Left Behind" plenary panel

--"Optical Wireless Convergence: Enhanced Service Performance, Reliability and Restoration"

--"Where is WiMAX Heading? Usage Models from Fixed to Full Mobility"

--"Convergence and Service-Provider Strategies"

Wednesday, June 7

--"Success-Based Ethernet Service: Mapping Deployment to Customer Demand"

--"IP Multimedia Subsystem: Myths versus Realities"

--"Converged Networks and IMS: Making High-Speed Data Applications Mobile"

The IEC Executive and Communications Forums each feature a three-day line-up of keynote speakers, panels and executive workshops centered around the hottest topics in communications, focusing on the networks and services within technologies like IMS/convergence, IPTV, Ethernet and home networks.

The IEC Executive and Communications Forums represent one component of the world-class speaker program planned for GLOBALCOMM 2006. The event will provide attendees with a comprehensive view of the global information and communications technology (ICT) marketplace. The conference program will include a series of GLOBALCOMM Summits, produced by TIA, focusing on the Americas, Europe-Middle East-Africa, and Asia-Pacific, as well as an Innovations Summit -- the latter featuring presentations by new and emerging technology companies. In addition, TIA, organizer of the Supplier Diversity summits held at SUPERCOMM, will produce a new TIA Supplier Diversity Summit at GLOBALCOMM.

GLOBALCOMM 2006 will feature 450 exhibiting companies, free keynote addresses and panels, paid conferences by the International Engineering Consortium, Light Reading/CMP Media, Telephony and other organizations, and co-location with OSP EXPO, the Outside Plant Exposition and Conference.

About IEC

A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry-leading companies, the IEC has developed an extensive, free on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age. More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. The IEC also manages the activities of the Enterprise Communications Consortium. Please visit www.iec.org. For additional information on the IEC Communications Forums visit http://www.iec.org/events/2006/iec_forums/.> About TIA

TIA is the leading trade association for the information and communications technology (ICT) industry. As owner and producer of GLOBALCOMM(TM), TIA represents global ICT suppliers and their service provider and enterprise customers through its leadership in standards development, domestic and international policy advocacy, and facilitating member business opportunities. TIA represents the communications sector of the Electronic Industries Alliance (EIA). Visit us at http://www.tiaonline.org.

About GLOBALCOMM(TM)

GLOBALCOMM(TM) is a trademark of the Telecommunications Industry Association (TIA). The Next-Generation Communications Marketplace and Summit will take place June 4-8, 2006, at McCormick Place in Chicago, Illinois, USA. Visit www.globalcomm2006.com.