International Rectifier to Showcase Power Management Innovations at Intel Developer Forum in San Francisco

Business Wire, March 7, 2006

SAN FRANCISCO -- International Rectifier, IR(R) (NYSE:IRF), a world leader in power management technology, will highlight its latest power management innovations for high performance computing at the Intel Developer Form (IDF) taking place in San Francisco's Moscone Center West, March 7 to 9, 2006.

"Intel's Core Duo platform offers impressive performance gains and, along with these gains, come unprecedented power management challenges. Our industry-leading power management technologies, chipsets and architectures make us well-equipped to respond with the required power efficiencies and densities," said Gene Sheridan, vice president of International Rectifier's Computer and Communications Group.

At IDF, International Rectifier will highlight its product families addressing the latest VRM standards, including:

XPhase(TM) Control Chip Set and Distributed Power Architecture

IR's XPhase chip set is a scalable, distributed power architecture for today's advanced microprocessors. Developed specifically for multiphase interleaved buck DC-DC converters, IR's XPhase chip set consists of a control IC and multiple Phase ICs. Unlike other multiphase solutions that are limited in the number of phases they drive, IR's XPhase architecture can support from one to "X" phases, which can be added or removed without changing the fundamental design.

iPOWIR(TM) Integrated Power System Building Blocks

The iPOWIR multi-chip modules are intelligent, scalable power system "building blocks" that provide high current density for multiphase converters as well as dual and single output synchronous buck converters.

The iPOWIR family is an example of IR's power management expertise in all areas and is much more than simply integrating functions. Benchmark power semiconductors are matched with control ICs, optimized multi-chip packaging and advanced system design. Only when all of these aspects are combined can complete functionality be bundled into a tiny, easy to design solution.

Patented DirectFET(R) MOSFET Chip Sets

International Rectifier's patented DirectFET power package is a breakthrough surface-mount power MOSFET packaging technology designed for efficient topside cooling in either an SO-8 or Micro8 footprint. In combination with improved bottom-side cooling, the package can be cooled on both sides to cut part count by up to 60%, and board space by as much as 50% compared to devices in standard or enhanced SO-8 packages. This effectively doubles current density (A/in2) at a lower total system cost.

The DirectFET MOSFET family includes matched 20V and 30V synchronous buck converter MOSFET chip sets, as well as 40V and 100V devices targeted at primary side control and synchronous rectification in 24V and 48V input power supplies.

In addition, new chip sets that include DirectFET(R) power MOSFETs and a PWM control IC with integrated drivers enable as much as 40% smaller circuit size and reduced part count.

For more information, please visit International Rectifier on the show floor or visit them on the web at www.irf.com.

About International Rectifier

International Rectifier (NYSE:IRF) is a world leader in power management technology. IR's analog and mixed signal ICs, advanced circuit devices, integrated power systems and components enable high performance computing and reduce energy waste from motors, the world's single largest consumer of electricity. Leading manufacturers of computers, energy efficient appliances, lighting, automobiles, satellites, aircraft and defense systems rely on IR's power management benchmarks to power their next generation products. For more information, go to www.irf.com.

Trademark Notice

DirectFET(R), iPOWIR(TM), IR(R) and XPhase(TM) are trademarks or registered trademarks of International Rectifier Corporation. IR's proprietary DirectFET technology is covered by US Patent 6,624,522 and other US and foreign pending patent applications.

All other product names noted herein may be trademarks of their respective holders.