CPI's Popular TeraFrame™ Cabinet System and Vertical Exhaust Duct System Are Added To New CoolSim™ 2.2

Business Wire, April 17, 2007

WESTLAKE VILLAGE, Calif. -- Chatsworth Products, Inc. (CPI), a leading manufacturer that sets the benchmark by providing superior structural support to organize, store and secure IT infrastructure equipment teamed up with software developer ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, to incorporate CPI's TeraFrame[TM] Cabinet System and Vertical Exhaust Duct System into their new CoolSim[TM] 2.2. (CoolSim technologies are now part of the ANSYS suite, from the ANSYS acquisition of Fluent, Inc. in 2006.)

CoolSim 2.2 is an interactive CFD tool that facilitates quick and accurate simulations of airflow and temperature distribution throughout a data center, by allowing users to include unique variables for specific configurations. This software saves customers time and money by pinpointing problems such as hot spots and airflow re-circulation so that the appropriate changes can be implemented in the data center to reduce downtime, extend the life of equipment and optimize energy costs. By including a pre-configured cabinet like CPI's TeraFrame and a passive cooling solution such as the Vertical Exhaust Duct System into the new version of CoolSim, customers are able to easily design and justify more cost-effective spaces for high-density deployments.

"The management of hot and cold streams is the key factor in obtaining effective and desired cooling performance in the data center," explained Dr. Kishor Khankari, Project Manager, CoolSim, ANSYS, Inc. "CPI's Vertical Exhaust Duct System technology is one of such measures to keep the hot and cold streams separated in the data center spaces. The instant availability of this technology in CoolSim software will help data center professionals to visualize and verify the benefits of this technology."

Until the release of CoolSim 2.2, companies who were interested in getting verification of CPI's high-density passive cooling solutions were limited to securing visits at existing customer sites. "The new version of CoolSim provides a great benefit to the data center design and management communities. Now, those members of the IT community who have already come to rely on the power and accuracy of the CoolSim CFD tool can create much higher density models and demonstrate practical cooling scenarios to their managers or customers. We can expect a chorus of, 'Wow, who knew?' rising up from offices all across the country," stated, Ian Seaton, Technology Marketing Manager of CPI.

Simulating and creating a fully functional data center is now easier than ever with CoolSim 2.2. The dimensions and specs required to configure a solution using TeraFrame Cabinets that accommodate CPI's Vertical Exhaust Duct System have been programmed into the CoolSim 2.2 software. This offers customers a pre-configured cabinet from the drop-down menu which achieves a high-density cooling solution without the hassle of having to enter dimensions and specs for a solution.

CPI's TeraFrame Cabinet System was designed to solve thermal issues in the data center and offers patent pending thermal control with zero points of failure. The Vertical Exhaust Duct System, a CPI Passive Cooling[TM] Solution, allows users to move hot exhaust air from the rear of the cabinet to a drop ceiling plenum or high point in the room. CoolSim 2.2 now demonstrates the powerful cooling capabilities that proper airflow can achieve using the TeraFrame and Vertical Exhaust Duct System, supporting thermal densities 3-5 times higher than conventional wisdom has previously indicated possible.