Epson Selects MA200Compact Mask Aligner from SUSS MicroTec for Wafer Level Chip Scale Packaging

Business Wire, Feb 5, 2007

MUNICH, Germany -- Seiko Epson Corp. ("Epson"), world leader in printing and imaging products, has purchased an MA200Compact Mask Aligner from SUSS MicroTec (FWB:SMH)(GER:SMH), the leading supplier of precision manufacturing and test systems, to support their Wafer Level Chip Scale Packaging (W-CSP) production. After a careful evaluation of competitive systems Epson decided on SUSS' MA200Compact Aligner because it demonstrated excellent throughput and a submicron overlay and alignment accuracy. In addition, the MA200Compact has been optimized for advanced thick chemically amplified positive tone resists that allow for ninety degree resist profiles. The system that was purchased during the fourth quarter of 2006 will be delivered to Epson's facility in Japan.

Mask aligners are proximity printing tools where mask and wafer are separated by an exposure gap in the range between 20 and 100 microns. Compared to steppers, where multiple shots may be necessary to expose a full wafer, the mask aligner is able to expose the wafer in one shot, which results in a significant throughput advantage. Proximity aligners offer a low cost lithography solution for high volume production. The SUSS MA200Compact combines proven mask aligner technology with innovative features such as the patent pending DirectAlign[R] option. With a guaranteed alignment accuracy of 0.5 microns at 3 sigma DirectAlign increases the mask aligner process window for a variety of new thick resist applications.

"The spirit of creativity and challenge is at the heart of Epson's corporate ethos", comments Akira Makabe, General Manager of Advanced Technology Development Center at Epson. "To keep up with the creation of unique technologies and skills we are constantly seeking for innovative equipment solutions. We chose SUSS MicroTec's MA200Compact, because it combines proven mask aligner technology with highest resolution, submicron overlay accuracy and an excellent wafer yield. The SUSS MA200Compact was able to meet even our most demanding performance criteria."

Rolf Wolf, managing director of SUSS MicroTec' lithography division, noted, " We are pleased that one of the world's most innovative companies in the digital image sector has selected the SUSS MA200Compact to support its Wafer Level Chip Scale Packaging production. SUSS is excited to be participating in the remarkable progress that is currently being made in Wafer Level Packaging manufacturing. This order further solidifies SUSS' position as the leading supplier of production mask aligner systems."

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information, please visit http://www.suss.com

About Epson

Epson is a global leader in imaging products including printers, 3LCD projectors and small- and medium-sized LCDs. With an innovative and creative culture, Epson is dedicated to exceeding the vision and expectations of customers worldwide with products known for their superior quality, functionality, compactness and energy efficiency.

Epson is a network of 102,025 employees in 120 companies around the world, and is proud of its ongoing contributions to the global environment and to the communities in which it is located. Led by the Japan-based Seiko Epson Corp., the Group had consolidated sales of 1549.5 billion yen in fiscal 2005. URL: http://www.epson.co.jp/e

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