SUSS MicroTec Signs License Agreement with Philips Research to Develop a New Nano Imprinting Technology: Substrate Conformal Imprint Lithography

Business Wire, April 29, 2008

MUNICH, Germany -- SUSS MicroTec (FWB:SMH)(GER:SMH), supplier of innovative solutions for the 3D, MEMS, Advanced Packaging and Nanotechnology markets, has entered a license agreement with Philips Research, Eindhoven/The Netherlands, for a new enabling technology called Substrate Conformal Imprint Lithography (SCIL). The aim of this cooperation is to bring an existing equipment platform with this additional Nanoimprinting (NIL) feature to the market, enabling new approaches to large-area imprint applications along with excellent printing resolution and repeatability.

This new imprint technology for sub-50nm patterning is bridging the gap between small rigid stamp application for best resolution and large-area soft stamp usage with the usual limited printing resolution below 200nm. SCIL is an enabling technology offering the best of two worlds - large-area soft stamps with repeatable sub-50nm printing capability, avoiding stamp deformation as no contact force is applied, non-UV based curing at room temperature and allowing high aspect ratios even up to 1:5 and more.

The lab aligner platform from SUSS MicroTec, handling the 150 and 200 mm UV-lithography like MA6 and MA8, will be available and upgradeable with this feature. Immediate availability for sampling is given with the current test setup. Market introduction with fully implemented SCIL functionality into Suss` lab aligners is scheduled for later this year.

"SCIL represents an enabling new technology that paves the way for further commercialization of nanoimprint lithography", said Rolf Wolf, general manager of SUSS MicroTec lithography division. "This collaboration with Philips Research significantly broadens the range of nanoimprint lithography processes we can offer our customers."

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, and probe systems. Headquartered in Munich, Germany, SUSS has 4 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information, please visit http://www.suss.com

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