High Growth Forecasted for the World Thin Layer Deposition Equipment Market

Business Wire, Dec 19, 2008

7. Product Innovations/ Introductions II-42 Oerlikon Balzers Introduces Low-temperature PVD Coatings II-42 Tokyo Electron Introduces Trias[TM] HP Ti II-42 Applied Materials Launches Applied Producer[R] BLOk[TM] II PECVD System II-42 ASM International Launches Eagle[R] XP Platform II-43 Applied Materials Introduces Applied SunFab[TM] Thin Film Line II-43 Applied Materials Launches Applied Producer[R] ACE[TM] SACVD[R] System II-43 Axcelis Launches Optima XE High Energy Ion Implanter II-44 First Nano Launches ET2000-SS and ET3000-SS Solid Source Deposition System II-44 Novellus Launches VECTOR Extreme[TM] PECVD System II-44 Denton Launches Discovery 785 Deposition System II-44 Tokyo Electron Rolls out Trias[TM] High-k CVD System II-45 Novellus Systems Unveils Vector Express II-45 Veeco Unveils TurboDisc K-series MOCVD Platform II-45 Veeco Instruments Introduces New Vapor Deposition System II-45 Applied Materials Unveils AKT-PiVot Deposition System II-45 Veeco Launches PV-Series of Thermal Deposition Sources II-46 Applied Materials Introduces Advanced Strain Engineering Technology II-46 Oerlikon Balzers Introduces BALINIT[R] ALDURA Coatings for Cutting Tools II-46 ASM Announces Availability of Pulsar[R] ALCVD[TM] Module for Volume Production II-47 Novellus Introduces Enhancement for INOVA[R] 300 mm System II-47 Novellus Introduces Vector Express with AHM[TM] Technology II-47 Applied Materials Launches Applied Producer[R] GT[TM] II-47 sp3 Unveils Advanced Diamond Deposition System II-48 IMEC and Applied Materials Introduce 22nm, 32nm Interconnects II-48 ASM Introduces Stellar[TM] 3000 Multi-Chamber PEALD Tool II-48 Tokyo Electron Launches Trias[TM] LT Ti/TiN II-49 Tokyo Electron Unveils TELINDY[TM] IRad[TM] II-49 Oerlikon Balzers Introduces P3e[TM] Technology for Cutting Tools II-49 Applied Materials Introduces Endura[R] iLB[TM] II for 45nm Contacts II-50 Applied Materials Announces Applied Producer[R] APF[TM]-e (1) System II-50 Ionbond Introduces Thermal Diffusion Coatings II-50 Jusung Develops Semi-Batch LP CVD process II-50 French Inventors Develop A New Thin Layer Deposition Process II-51

8. Focus on Select Players II-52 AIXTRON (Germany) II-52 Applied Materials, Inc. (USA) II-52 ASM International N.V. (The Netherlands) II-52 Axcelis Technologies, Inc. (USA) II-53 Canon ANELVA Corporation (Japan) II-53 CHA Industries (USA) II-53 CVD Equipment Corporation (USA) II-54 Denton Vacuum (USA) II-54 Edwards Limited (UK) II-55 Ibis Technology Corporation (USA) II-55 Implant Sciences Corporation (USA) II-55 Ionbond AG (Switzerland) II-55 Jusung Engineering Co., Ltd. (Korea) II-56 KDF Electronic & Vacuum Services, Inc. (USA) II-56 Kokusai Semiconductor Equipment Corporation (USA) II-57 Kookje Electric Korea Co., Ltd. (Korea) II-57 Novellus Systems, Inc. (USA) II-57 OC Oerlikon Corporation AG (Switzerland) II-58 RIBER SA (France) II-58 Seki Technotron USA (USA) II-58 SEN Corporation (Japan) II-59 Silicon Genesis Corporation (USA) II-59 Tecvac Limited (UK) II-59 Tegal Corporation (USA) II-60 Ti-Coating, Inc. (USA) II-60 Tokyo Electron Limited (TEL) II-60 Ultramet (USA) II-60 ULVAC Technologies, Inc. (USA) II-61 Vapor Technologies, Inc. (USA) II-61 Veeco Instruments (USA) II-61