FSI International Receives Order for ORION Single Wafer Cleaning System from Major Semiconductor Manufacturer

Business Wire, Dec 23, 2008

Order represents acceptance of new single wafer cleaning technology for 32nm applications

MINNEAPOLIS -- FSI International, Inc. (Nasdaq: FSII) a leading supplier of wafer processing, cleaning and surface conditioning equipment for semiconductor manufacturing, announced today the receipt of an order for its new ORION([R]) single wafer cleaning platform from a major semiconductor manufacturer. The order represents acceptance of the evaluation tool shipped to this customer in May 2008 for its back-end-of-line (BEOL) 32nm development program. The system's unique closed-chamber design addresses several critical path cleaning issues, including the control of material loss and galvanic corrosion in copper interconnects with and without metal containing capping layers. This enables IC manufacturers to implement defect-free next generation copper interconnection schemes.

"This order is important to us on many levels," said Don Mitchell, FSI's president and CEO. "It validates the critical capabilities of the ORION for 32nm applications. It also demonstrates this customer's conviction that those capabilities add sufficient value that even in a deep industry down-cycle, manufacturers are willing to invest in innovative technology, not only to prepare for the future, but also to realize current gains."

The ORION's three-dimensional cluster configuration delivers high throughput, great flexibility and the most efficient use of space available. The system incorporates many of FSI's proven core technologies: in-line chemical blending and control; energetic aerosol chemical and water delivery; and flexible, recipe-driven procedures to deliver uncompromised process performance. Its modular design accommodates multiple chamber types and permits the addition of modules to increase maximum throughput.

The ORION's unique closed-chamber design also addresses critical path issues encountered in front-end-of-line processing. It permits the use of volatile, highly-reactive chemistries for single step, all wet stripping of the highly implanted photoresist created during the fabrication of 32nm devices. By eliminating ashing, it not only reduces material loss but also decreases the cycle time, process complexity and the number of tools and process steps.

FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the Company's broad portfolio of cleaning products, which include batch and single wafer platforms for immersion, spray, vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals. The Company's support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. For more information, please visit FSI's website at http://www.fsi-intl.com.