Renesas Technology Unveils Ultracompact 2G/3G Dual-mode RF Transceiver for Mobile Phones and 3G Communication Cards for PCs

Business Wire, Feb 11, 2008

Device Reduces Mounting Area by Approximately 20% and Integrates High-Frequency Signal Processing Functions for GSM and W-CDMA/HSPA Communications

SAN JOSE, Calif. -- Renesas Technology America, Inc. today announced the R2A60281LG, an ultra-compact 2G/3G dual-mode radio frequency (RF) transceiver that supports both the 2G and 3G modes used in cellular communications. The device integrates in a single chip most of the high-frequency signal processing functions required by mobile phone handsets, including the down conversion of high-frequency wireless signals to a lower frequency to be used by the baseband processor.

The R2A60281LG is only 7x7x0.6 mm (about 20% smaller than previous solutions). It combines multiple functions and eliminates the need for an analog baseband processor. Therefore, it will facilitate the development of smaller and thinner handsets for GSM and W-CDMA/HSUPA/HSDPA networks used as the global mobile telephony standards. The transceiver also can be applied in 3G communication cards for PCs.

Multiple industry trends are driving the need for the new transceiver. Many mobile phone users are expected to replace older phones with global 3G models that also support the GSM (2G) standard. At the same time, there is a growing demand for handsets that support more than one frequency band. Feature-rich handsets offering an array of multimedia functions, such as terrestrial TV broadcast reception, are becoming more popular, making it necessary to mount more electronic devices on handset circuit boards, even as the handsets themselves become thinner. The new transceiver builds on previous Renesas RF transceiver technology and addresses these trends by supporting multiple frequency bands and both the 2G and 3G modes, while also offering faster operation and a smaller, thinner package.

Specifically, the R2A60281LG integrates 2G (GPRS/EDGE) quad-band (850MHz/ 900MHz/ 1.8GHz/ 1.9GHz) and 3G (W-CDMA) quad-band (800MHz/ 1.5 GHz/ 1.7 GHz/ 2 GHz) functionality into a single chip. It also supports High-Speed Downlink Packet Access*1 (HSDPA) categories 7 and 8 for fast data downloads at speeds up to max. 7.2 Mbps as well as High Speed Uplink Packet Access (HPUPA). The chip is built in 0.18 micrometer Bi-CMOS technology.

The transceiver includes the low-noise amplifiers (LNAs), a loop filter*2 circuit, HPA controls and more. A filter supporting CDMA2000 attenuates wavelengths outside the desired frequency band, reducing susceptibility to radio frequency interference (RFI). Also, a 312Mbps (max.) digital interface function supports 3G DIGRF operation, offering the A/D and D/A conversion functions formerly handled by an analog baseband processor. This interface enables high-speed exchanges of In-Phase/Quadrature-Phase (I/Q) and control data with a digital baseband processor, for quick transfers of large data volumes.

The R2A60281LG 2G/3G dual-mode RF transceiver looks to the future, as well, by also supporting the 1.5GHz band under the specifications newly standardized by the Third Generation Partnership Project (3GPP), an international body for establishing 3G mobile phone standards. Renesas' development plans for RF transceiver products include new chips offering support for the 3G-LTE*3 and 4G modes that will enable even faster communication speeds.

Prices and Availability

Product Name  <               <  Package

Sample Price/ Availability
R2A60281LG    <               <  120-pin LGA

$9/ March 2008
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* Product names, company names, or brands mentioned are the property of their respective owners.

About Renesas Technology Corp.

Renesas Technology Corp. is one of the world's leading semiconductor system solutions providers for mobile, automotive and PC/AV (Audio Visual) markets and the world's No.1 supplier of microcontrollers. It is also a leading provider of LCD Driver ICs, Smart Card microcontrollers, RF-ICs, High Power Amplifiers, Mixed Signal ICs, System-on-Chip (SoC), System-in-Package (SiP) and more. Established in 2003 as a joint venture between Hitachi, Ltd. (TOKYO:6501) (NYSE:HIT) and Mitsubishi Electric Corporation (TOKYO:6503), Renesas Technology achieved consolidated revenue of 953 billion JPY in FY2006 (end of March 2007). Renesas Technology is based in Tokyo, Japan and has a global network of manufacturing, design and sales operations in around 20 countries with about 26,500 employees worldwide. For further information, please visit http://www.renesas.com.

Specifications: New Renesas Technology 2G/3G Dual-mode RF Transceiver for Mobile Phones, 3G Communication Cards

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