Research and Markets: Materials of All Active Semiconductors and Passive Components is Presented in the 'Ericsson KRB1011048/60 WCDMA 2100MHZ Power Amplifier Tear Down Report'

Business Wire,  July 16, 2008  

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DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/research/5e9a66/ericsson_krb101104) has announced the addition of EJL Wireless Research's new report "Ericsson KRB1011048/60 WCDMA 2100MHZ Power Amplifier Tear Down Report" to their offering.

This report covers the design analysis of an Ericsson W-CDMA 2100MHz power amplifier unit. This unit is an integral part of an Ericsson W-CDMA base transmitting station (BTS). The unit was manufactured in early 2003. A complete bill of materials of all active semiconductors and passive components is presented with the following information:

- Complete Part Number/Marking

- Component Manufacturer Identification

- Functional Component Description

- Package Type

This report is a design "teardown" analysis of an Ericsson W-CDMA power amplifier; model number KRB 101 1048/60. A simplified mechanical analysis of the unit along with detailed bill of materials analysis is presented in this report. Active/Passive Component Summary

Total Weight:

-Total Active/Passive Components:

-Total Active Components:

-Total Passive Components:

Important Note:

This particular unit was built in March 2003, given the date codes present on many of the semiconductor integrated circuits contained within the unit as well as on the front panel of the unit. All of the components contained within the bill of materials analysis are presumed to be non-RoHS compliant. Where possible, all components, both passive and active, have been identified with the manufacturer's part number within the bill of materials analysis.

This analysis does not include any pricing information or estimated costs on the mechanical design or for any passive or active components contained within the system. All dimensions, unless otherwise specifically stated, are in metric format.

Reasons to Buy:

- Proprietary Data

- Comprehensive Bill of Materials Analysis

- Mechanical Design Analysis

Features of the Product:

-Total Pages:

-Total Tables:

-Total Exhibits:

-Full Color Pictures of PCB and Modules

-Mechanical Drawings and Dimensions

-Complete Part Number Identification

-Complete Component PCB Placement

Targeted Users:

-Mobile Operators

-Base Station Equipment OEMs

-RF Subsystems Manufacturers

-Semiconductor Manufacturers

Key Topics Covered:

Table of Contents:

EXECUTIVE SUMMARY

-Active/Passive Component Summary

-Important Note:

ERICSSON W-CDMA RBS TECHNOLOGY

-Overview of Ericsson W-CDMA RBS Technology

W-CDMA POWER AMPLIFIER PRODUCT

-Mechanical Analysis

-System Architecture Analysis

-Digital Control Section

-DC/DC Power Supply Module Section

-RF Cavity Filter Section

-Small Signal RF Section

-High Power RF Section

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE

List of Tables:

- Digital/RF Cable Bill of Materials

- Digital Processing Section Bill of Materials

- Main PCB Emerson Part Number ROA 119 0696/1 R1B Bill of Materials

- Daughtercard 1 Emerson Part Number ROA 1190694/1 R1B Bill of Materials

- Daughtercard 2 Emerson Part Number ROA 119 0695/1 R1A Bill of Materials

- RF Cavity Filter Bill of Materials

- High Power RF Driver Pallet Bill of Materials

- High Power RF Output Pallet Bill of Materials

- High Power RF Error Amplifier Pallet Bill of Materials

- Active/Passive Component Distribution by System Subsection

List of Exhibits:

- Ericsson RBS 32025

- Power Amplifier System Case Dimensions

- Power Amplifier Case Top Cover Top View Dimensions

- Power Amplifier Case Top Cover Bottom View Dimensions

- Digital/RF Cables Component Diagram

- Power Amplifier Sub-System Diagram

- Basic Feed Forward Amplifier Block Diagram

- Digital Processing PCB Dimensions

- Digital Processing Section Component Diagram

- Power Supply Module, Top View

- Power Supply Module, Bottom View

- DC-DC Converter PCB Dimensions

- DC-DC Converter Component Diagram, Top

- DC-DC Converter Component Diagram, Bottom

- Daughtercard 1 Emerson Part Number ROA 1190694/1 R1B

- Daughtercard 2 Emerson Part Number ROA 119 0695/1 R1A

- RF Cavity Filter, Top

- RF Cavity Filter, Bottom

- RF Cavity Filter Transmit Diagram

- RF Cavity Filter Component Diagram

- Small Signal RF Section

- Small Signal RF Section w/ Standoff Shield

- Small Signal RF Cover Shield Top View

- Small Signal RF Cover Shield Bottom View

- Small Signal RF Transmit PCB Dimensions

- Small Signal RF PCB Bottom View

- Small Signal RF Transmit Chain

- Small Signal RF Transmit Component Diagram

- Small Signal RF Section Bill of Materials

- High Power RF Section Diagram

- High Power RF Transmit PCB Dimensions

- High Power RF Heat Sink Dimensions

- RF Main Amplifier Transmit Diagram

- Merrimac Industries Multi-Mix Splitter/Combiner

- High Power RF Driver Pallet Component Diagram

- High Power RF Output Pallet Component Diagram

- High Power RF Error Amplifier Transmit Diagram

- High Power RF Error Amplifier Pallet Component Diagram

- Component Distribution Analysis