Quantum Leap Packaging and the General Motors Corporation Co-Present "Revolutionary Polymer for Metal Replacement in Automotive Applications" at SPE Automotive Composites Conference and Exhibition

Business Wire, Sept 19, 2008

WILMINGTON, Mass. -- Quantum Leap Packaging, Inc. (QLP), a leading provider of high performance materials for semiconductor assembly, co-presented with General Motors Corporation (GM) at the SPE Automotive Composites Conference and Exhibition.

The paper titled, "Revolutionary Polymer for Metal Replacement in Automotive Applications" was coauthored by Dr. Mike Zimmerman of QLP, Charles Buehler and Dr. William Rogers of GM.

Charles Buehler and Dr. Mike Zimmerman jointly presented. Mr. Buehler, GM Materials Engineer, first presented automotive material needs such as low coefficient of expansion matching metals and high stiffness required for metal replacement and weight reduction in vehicles. Mr. Buehler discussed specific applications such as structural parts, support brackets, and high heat under-the-hood applications that require low weight, low expansion and gap control.

Dr. Zimmerman, CTO of QLP, then presented Quantech's(TM) material properties and included data generated by GM. A comparison of Quantech's(TM) material properties were made to steel, aluminum, magnesium and other polymers. The data showed significant advantages and demonstrated how Quantech(TM) is ideal for structural applications and metal replacement.

"Quantech(TM) is a new, innovative material", said Mr. Buehler. "Quantech's(TM) unique properties such as low coefficient expansion and high stiffness are ideal for structural and metal replacement applications needed for weight reduction."

Quantech(TM) has very low coefficient of expansion, very close to steel and aluminum with a high amount of stiffness, yet the density is much lower allowing significant weight savings. According to GM the new Quantech[TM] parts could be in new cars within 6 months, depending on application.

According to David Grooms, CEO of QLP, "Metal replacement and lightweight materials are a critical need for the future of vehicle weight reduction, and ultimately the improvement in fuel efficiency. The automotive industry is aggressively investigating new materials to pursue this effort. This is a new market for QLP and represents excellent growth opportunities for our materials technology."

About Quantum Leap Packaging Inc.

Quantum Leap Packaging, Inc. (QLP) is a material science company and a developer of enabling technologies. QLP's revolutionary material technology, Quantech(TM), solves critical thermal, stress and reliability issues faced in semiconductor assembly. QLP designs and manufactures high-performance hermetic and near-hermetic air cavity packages for applications such as Optical Electronic Systems, Image Sensors, HB-LEDs, MEMs, and High Power RF-Microwave assembly. QLP developed HermeTech(TM), the industry's first true plastic hermetic package, in a design and manufacturing breakthrough long sought by the industry. The breakthrough was made possible by QLP's innovative Quantech(TM)material, proprietary process technology and engineering design. For more information, please refer to www.qlpkg.com.