Apache Design Solutions to Demonstrate the Next Generation Power Integrity Solutions for IC Package and SiP Designs at ECTC 2009

Business Wire, May 21, 2009

SAN JOSE, Calif. -- Apache Design Solutions, the technology leader in power and noise integrity for chip, package, and system convergence, today announced that they will be participating at the upcoming Electronics Components and Technology Conference (ECTC) in San Diego, California, May 17 – 28, 2009. ECTC is the premier international packaging, components, and microelectronic systems technology conference. Apache will be demonstrating Sentinel, a complete power and noise analysis platform for IC package, PCB, and SiP designs in booth #220. The Sentinel products address the challenges associated with system-level power integrity, I/O-SSO, thermal, and EMI issues.

[Table Omitted]

About Apache Design Solutions

Apache delivers the industry’s leading global power and noise analyses platform solutions for Chip-Package-System convergence. Apache's innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog and custom IP, and System (IC package, SiP, PCB), while providing a co-analysis environment that integrates the SoC and System worlds. From early-stage to sign-off, Apache’s products are adopted by over 100 customers including 90% of the top IDM, fabless semiconductor, and foundries for cost reduction, risk mitigation, and time-to-market improvements. Apache is a global company with over 150 employees and R&D centers and direct sales / support offices worldwide. For more information, visit www.apache-da.com.

Apache Design Solutions, NSPICE, RedHawk, PakSI-E, PsiWinder, Sahara, Sentinel,Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc.