NEXX Systems Names Keith A. Miller As Packaging Alliance Program Manager

Business Wire, June 04, 2009

BILLERICA, Mass. -- NEXX Systems, a leading provider of processing equipment for advanced wafer-level packaging applications, today announced that it has named Keith A. Miller to serve as the Program Manager in NEXX's multi-year joint development program with IBM on advanced semiconductor packaging and integration. Specifically, the program will explore additional electroplating options for new interconnections in 3D and other advanced packaging applications. Mr. Miller comes to NEXX with extensive experience in the advanced semiconductor packaging industry, most recently at the WLCSP Division of Amkor in North Carolina. He holds both a bachelor's and master's degree in electrical engineering from North Carolina State University.

Stated Thomas Walsh, CEO of NEXX Systems, "We are delighted to have Keith join the NEXX team to manage this important technology development program. As Keith focuses on the product and process opportunities, his training and experience will greatly enhance the success of the program for all the participants."

Mr. Miller added, "I am looking forward to the challenges and opportunities that this program offers to NEXX and the alliance partnership. The further development and rapid adoption of 3D packages are vital to the successful realization of the next generation of smarter, faster consumer devices."

About NEXX: NEXX Systems brings exceptional technical expertise to the flip chip and advanced packaging markets. Our product lines provide the most efficient, yet affordable, systems of their kind: Stratus for high throughput electro-deposition of metals, and Apollo and Nimbus for multi-layer sputter deposition of metals. Additional information can be found at: www.nexxsystems.com.

“Safe Harbor” statement: This release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 regarding future events or the future performance of NEXX Systems. These statements are only predictions. Actual events or results may differ materially from those in other forward-looking statements set forth herein. Among the important factors that could cause actual events to differ materially from those in other forward-looking statements are potential fluctuations in quarterly results, dependence on new product development, rapid technological and market change, acquisition strategy, manufacturing and sourcing risks, volatility of stock price, international operations, financial risk management, and future growth subject to risks. NEXX Systems is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, future events or otherwise.