InterDigital Signs iWOW to Worldwide 2G and 3G Patent License Agreement

Business Wire, Jan 8, 2009

KING OF PRUSSIA, Pa. -- InterDigital, Inc. (NASDAQ: IDCC) today announced that its patent licensing subsidiaries have signed a non-exclusive, worldwide, royalty-bearing patent license agreement with Singapore-based iWOW Connections Pte Ltd (iWOW). The agreement covers the sale of wireless terminal units and infrastructure, including wireless machine-to-machine (M2M) devices, built to cellular Second Generation (2G and 2.5G) standards and Third Generation (3G) standards and to non-cellular wireless IEEE 802-based standards, through 2015.

iWOW designs, manufactures, and markets an extensive wireless connectivity product line for the machine-to-machine market using GSM, GPRS, and 3G technologies. The company's highly scalable embedded modules and ready-to-use modems address a wide array of applications in the emerging M2M market.

"This new agreement with a M2M company expands InterDigital's licensing coverage and allows us to participate in one of the fastest growing segments of the market," commented Lawrence Shay, President of InterDigital's patent subsidiaries.

About InterDigital

InterDigital[R] designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip([TM]) high performance mobile broadband modem solutions, consisting of Baseband ICs, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.

For more information, visit: www.interdigital.com

InterDigital is a registered trademark and SlimChip is a trademark of InterDigital, Inc.