Manufacturing Industry
Texas researchers claim dry-etch copper process - The Fab Line - Brief Article
Electronic News, April 1, 2002 by Jeff Chappell
TWO CHEMICAL ENGINEERS AT TEXAS A&M UNIVERSITY, YUE KUO and Sangheon Lee of the Thin Film Microelectronics Laboratory, have developed a method for dry etching copper, the university announced recently. Kuo and Lee have developed a dry-etch process in which the products of the plasma-copper reaction are easily removed by dipping the semiconductor wafer in a dilute acid solution and dissolving the byproducts, Texas A&M said.
The process can be carried out using commercial equipment under the same conditions as conventional copper processing, the researchers said.
COPYRIGHT 2002 Cahners Business Information
COPYRIGHT 2002 Gale Group
Most Recent Business Articles
- Multiple criteria evaluation and optimization of transportation systems
- Multi-criteria analysis procedure for sustainable mobility evaluation in urban areas
- A two-leveled multi-objective symbiotic evolutionary algorithm for the hub and spoke location problem
- Multi-criteria analysis for evaluating the impacts of intelligent speed adaptation
- The development of Taiwan arterial traffic-adaptive signal control system and its field test: a Taiwan experience
Most Recent Business Publications
Most Popular Business Articles
- 7 tips for effective listening: productive listening does not occur naturally. It requires hard work and practice - Back To Basics - effective listening is a crucial skill for internal auditors
- FAS 109: a primer for non-accountants - Financial Accounting Standards Board's "Statement 109: Accounting for Income Taxes"
- LIFO vs. FIFO: a return to the basics
- Too Young to Rent a Car? - 25-years-old the minimum age for car renting - Brief Article
- Design a commission plan that drives sales - Sales Commissions
Most Popular Business Publications
Content provided in partnership with
