Amkor, Unitive Set Tech Deal

Electronic News, April 17, 2000 by Bernard Levine

Amkor Technology Inc., West Chester, Pa., and Unitive Advanced Semiconductor Packaging, a Unitive Electronics company based in Research Triangle Park, N.C., have signed a 10-year technology transfer and licensing agreement that will add electroplated wafer bumping capability to Amkor's recently announced internal wafer bumping manufacturing line planned for Korea. The Unitive process for electroplated substrates is the latest key bump technology that Amkor has licensed for flip-chip production this year.

"Amkor's selection of our technology for their new wafer bumping line in Korea is confirmation of the industry view that electroplating-based technology will enable flip-chip packaging for more nonsilicon and wireless applications," said Robert Lanzone, vice president of sales and marketing for Unitive. "Additionally, our ability to perform redistribution with copper in a single- or multilevel scheme is considered an essential technology for this market. We can supplement Amkor's internal capability with our North American and Taiwan production lines to provide multisourcing," he said. "Electroplating-based bumping processes are proven in the industry," said Bruce Freyman, Amkor corporate vice president for product operations. "The technology represents a solid foundation for development in fine-pitch bumping, varied solder compositions, and wafer-level chip-scale packages."

Bel Adds SMT Connector Modules

Bel Fuse Inc., Jersey City, N.J., has added the first surface-mount products to its belMag family of shielded RJ-45 connector modules with integrated magnetics for 10/100 BASE-T Ethernet applications. The belMag family complies with IEEE 802.3u standards. The SMT belMag features a profile height of 0.502 inch and footprint of 0.670 inch, and is available in two pinout options, S811-1X1T-03 and -04. Price is $2.75 each in 10,000 quantities, with delivery 6 to 8 weeks.

Placement Moves

Juki Automation Systems Inc., Morrisville, N.C., will soon offer the 2000 Series of four modular pieces of surface-mount pick-and-place equipment typically purchased in a combo of two. The first model will be introduced later this month, with the other three machines expected later this year. A line could be purchased in the range of $300,000 to $1.2 million, dependent upon mix of the modular placement machines, designated KE-2010, KE-2020, KE-2030, and KE-2040.

Partnering

Contract manufacturer MCMS Inc., Nampa, Idaho, reports a manufacturing partnership with Tachion Networks Inc., Eatontown, N.J.,for Tachion's Collapsed Central Office next-generation broadband service solution.