Flipping Out

Electronic News, May 7, 2001

WATCH FOR LSI LOGIC CORP. MILPITAS, CALIF., TO UNVEIL today a new flip-chip packaging product for communications and storage markets. LSI Logic (nyse: LSI) will announce the flxI/O flip-chip, its third generation of organic (plastic) flip-chip packaging products, offering ASIC and system-on-a-chip designers improvements in signal I/O density and electrical performance, and a reduction in die size, when compared to peripheral I/O packages.

LSI claims that rather than restricting signal I/Os to the periphery of the die, flxI/O flip-chip uses an area-array approach for signal I/O placement to optimize die size and increase signal I/O counts. The flxI/O allows signal I/O placement anywhere on the die, allowing a reduction in die size of as much as 60 percent, or increasing signal I/O density up to 65 percent, according to LSI.