Macrotron Introduces 3D Solder Paste Inspection Tool

Electronic News, June 4, 2001

MUNICH, GERMANY-BASED MACROTRON PROCESS TECHNOLOgies recently introduced a solder paste inspection system with a 3D option. Named the MVS-1B, it increases existing Macrotron tools' throughput by 50 percent, or 7.27[cm.sup.2] per second at a 20-micron resolution, with the use of a high-resolution camera in the 2D module, the company said.

The MVS-1B detects defects such as displacements, scratches, short circuits, undesirable materials in the paste, and process deviations by measuring the exact volume of the paste, the company said. The 3D camera achieves a lateral resolution of 10 micron and height accuracy down to 5 micron, the company said. Inspection programs may be established either by using the existing CAD data or by manual teaching of the board. Both are possible in an off-line mode, Macrotron said.