Electronic News

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Articles in June 18, 2001 issue of Electronic News

• 2001 Ad
  by Stven Fyffe
• Jockeying for Position
  by Jeff Chappell
• Anadigics Axes 65 Jobs, Expects Second-Quarter Loss
• Agilent Names Microlease as European Lease Partner
• ARC Debuts Instruction-Set Architecture for Cores
• Synopsys Prepping Mixed Signal Play?
• USB 2.0 Hits Retail Shelves
  by Ruben Cadena
• Sekidenko Introduces Deposition Rate Tuner
• SOC Drives Transition to SLD
  by Guido Arnout
• Arrow Inks Distribution Deal with EMC
  by Rob Spiegel
• Synopsys Talks Up Router—Finally
  by Gale Morrison
• Discontinuities In Soc Verification
  by Walden C. Rhines
• Infineon, Canon to Develop 157nm Systems at 0.07 Micron
• Advantest T5375 Tests 300mm Front-end DRAMs and Flash
• Mentor, Synopsys Move to Enhance VSIA Initiatives
• White House Role in ASML/SVG Merger Questioned
• BUSINESS & FINANCE
• Ibis Taking Orders for SOI Process Wafers
• 2001 Ad
  by Roy Jewell
• Converge Brings Fujitsu Aboard
  by Rob Spiegel
• Avnet Makes Waves
  by Heidi Elliott
• Celestica to Acquire Omni Industries
• ARMing for a Fight
  by Tom Murphy
• Aehr Test Systems Nabs First Wafer-Level Burn-In Order
• The Reality of Product Design Innovation
  by Y.C. Pati
• Logical Move
• Dongbu Forges On
  by Tom Murphy
• Infineon Chooses ASML, Novellus for 300mm Tools
• Time for a Shift in SOC Design
  by Jacques Benkoski
• White—Collar Downturn
  by Rob Spiegel
• Rambus Unveils RDRAM, RIMM Roadmap
  by Alex Romanelli
• TWI Jumps into Hard Pad Market
  by Jeff Chappell
• Credence Expands Memory Products Facility
• Top 10 Semiconductor Ip Companies Worldwide—2000 Calendar Year
• 2001 Ad
  by Tom Murphy
• PCs in the Home?
  by Bernard Levine
• Axcelis Technologies, Dow Corning Team Up on Low K
• Going Formal Dresses SOCs for Success
  by C. Michael Chang
• Richardson Is Down for the Quarter, Up for the Year
  by Rob Spiegel
• 2001 Ad
  by Bernard Levine
• Tyco Targets Surface-Mount Gear
  by Bernard Levine
• Varian Implant Patent: Process Can Cut Four Masking Steps
• Multitest AG Joins Everett Charles Technologies
• The Downturn's Hidden Opportunities
  by Rob Spiegel
• Are We at the Bottom Yet?
  by Rob Spiegel
• Let the Services Begin
  by Heidi Elliott
• KLA-Tencor Develops Wafer-Stress Management Tool
• Ahhh, Verification Relief
  by Ramon Nunez
• Viacore to Build Cisco's Private Exchange
  by Rob Spiegel