Manufacturing Industry
Alcatel, UMC Ink Agreement for Communications Products
Electronic News, July 23, 2001
ALCATEL AND UNITED MICROELECTRONICS CORP. (UMC) LAST week signed an agreement that Alcatel (nasdaq: ALAO) would utilize UMC's 0.13-micron WorldLogic CMOS process for next-generation communication chips. "Alcatel's commitment to leverage the 0.13-micron process follows a long history of close cooperation between the two companies at previous-generation technologies, 0.35-micron BiCMOS and CMOS to 0.25- and 0.18-micron CMOS," said Jim Kupec, senior vice president of worldwide sales and marketing at UMC (nyse:UMC).
Alcatel hopes this agreement will enable the company to set itself apart from other communication companies in terms of size, speed and power-savings in chips and chipsets. Alcatel's design activity will be facilitated by the Fusion library that includes standard cells, I/O and memory compilers that are available to UMC from Virtual Silicon Technologies Inc.
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