Electronic News

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Articles in July 22, 2002 issue of Electronic News

• Connectivity inside: Intel to move comms technology manufacturing in-house - Exclusive
  by Tom Murphy
• Open architecture in question: ATE vendors give mixed reviews to test consortium kickoff - News - Automated test equipment; Semicon West 2002 trade show report
  by Jeff Chappell
• PCI express pulls into station - Semiconductors - Peripheral Component Interface SIG releases PCI Express specification
  by Gale Morrison
• Cadence Design Systems to OEM InterComm - Off the Shelf - Brief Article - Product Announcement
  by Rob Spiegel
• Off with their heads - The Antenna - Probe Research's market caps figures - Brief Article
• Wireless convergence debate rages on - Comment - smart phones and personal digital assistants converge
  by Bryan Coley
• Metrology assuming larger role with recovery - Special Section: Wafer Processing - semiconductor industry forecasts
  by Jay Lindquist
• No fit - The Antenna - Avnet - Brief Article
• Nvidia taking new markets in force: new chipset offers best drive into corporate segment - Semiconductors - Nvidia ships nForce2 graphics chipset - Product Announcement
  by Tom Murphy
• Sager Electronics nabs exclusive RCD deal - Off the Shelf - RCD Components distribution agreement - Brief Article
  by Rob Spiegel
• A glimmer of hope - The Antenna - Brief Article
• Business & Finance - electronics industry stock report - Statistical Data Included
• Adapting to change key to surviving downturn - Special Section: Wafer Processing - semiconductor industry forecasts
  by George Collins
• Korea: a billion-dollar market - Connect with Fleck - Statistical Data Included
  by Ken Fleck
• HPL sacks CEO; combs through books - The Antenna - HPL Technologies - Brief Article
• Opto's sun will come out: not necessarily tomorrow, though - Business & Finance - optoelectronics industry forecast
  by David Manners
• Distributors: improve your return on capital - Distribution - electronics industry distribution practices
  by Rob Spiegel
• Who will buy Transmeta? - The Antenna
• Take your partners: universities find alternate ways to tackle ASIC development costs - Business & Finance - application-specific integrated circuits
  by Harry Yeates
• Premier Farnell taps Bain for COO - Off the Shelf - Brief Article
  by Rob Spiegel
• Who set those standards? In the wake of outsourcing, alliances become increasingly important
  by Bernard Levine
• i2 cuts 1,400 jobs: struggling SCM giant slices 30% - News
  by Rob Spiegel
• 2002: no real recovery just yet; utilization rates improve, device building up, but still much to be done before recovery - Special Section: Wafer Processing - semiconductor industry report
  by Lee Cook
• Richardson Electronics gets QS-9000 - Off the Shelf - Brief Article
  by Rob Spiegel
• Applied knowledge: chairman and CEO Jim Morgan talks acquisition integration and more - News - Applied Materials - Interview
  by Ed Sperling
• The cutting edge - Viewpoint - jail CEO and accountant criminals - Column
  by Bernard Levine
• Can DFT really save me money? - Special Section: Wafer Processing - design-for-test integrated circuit design
  by Kenneth Posse
• Tessera makes most of Semicon West: company adds stacked package and new clip-scale licensee - Packaging - Tessera Technologies MicroZ - Product Announcement
  by Bernard Levine
• InfiniBand throttles down
  by Gale Morrison
• Pass the prozac - Earnings Reports - electronics industry report
  by Heidi Elliott
• Effective, quick transitions key to survival and recovery - Special Section: Wafer Processing - semiconductor industry forecasts
  by John Kibarian
• Avnet names Vogt VP and general manager - Off the Shelf - Roland Vogt - Brief Article
  by Rob Spiegel
• Faulty logic - Clear Logic Inc
  by Alex Romanelli
• Editor's note - Viewpoint - communications industry searches for the next technology - Editorial
• Recovery? Time, IT spending will tell - Special Section: Wafer Processing - semiconductor industry forecasts
  by Lou Steen
• Expect a flat summer: parts orders stable through June, ECA says - Packaging - component forecasts by Electronic Components, Assemblies and Materials Association - Brief Article
  by Bernard Levine