NuTool adds more traditional CMP to technology stable - The Fab Line - NUTOOL INC. ships LUMINACU RL-CMP chemical mechanical planarization tool - Brief Article - Product Announcement

Electronic News, August 5, 2002

NUTOOL INC.'S LUMINACU RL-CMP, A 300MM CHEMICAL mechanical planarization (CMP) tool, combines a high-linear velocity component providing high polishing rates with a low down-force component enabling dishing and erosion performance in the range of 200 Angtroms or less with almost no global oxide loss, the company said.

The startup's latest tool is designed to polish both copper and barrier metals at the same polishing station. Noted for its electrochemical mechanical deposition (ECMD) technology, which planarizes copper as it is deposited, NuTool launched the LuminaCu after customer requests for its planarization technology in a stand-alone machine. ECMD can be added to the LuminaCu platform, however. The LuminaCu system delivers up to 60 wafers per hour for typical copper CMP applications, while the LuminaCu ECMD can produce up to 90 wafers per hour, NuTool said.