Applied offers fixed abrasive CMP technology, eliminates dishing - The Fab Line - chemical mechanical planarization; Applied Materials' Reflexion Fixed Abrasive Web - Brief Article - Product Announcement

Electronic News, August 5, 2002

APPLIED MATERIALS INC. HAS UNVEILED A FIXED ABRASIVE chemical mechanical planarization (CMP) tool with a slurry-less process for forming shallow trench isolation (STI) structures in sub-100nm devices. Instead of using a polishing pad and slurry to planarize the wafer, the Reflexion Fixed Abrasive Web technology employs a roll of fabric-like material that contains the polishing abrasive.

Integrating the abrasive into the fabric eliminates dishing, or the removal of material from low areas on the wafer caused by free abrasive particles, Applied claims. Erosion is resolved by using nitride-selective chemistry that curtails polishing once nitride is exposed, according to the company. The technology is extendible to the 65nm node, Applied said. It has multiple Reflexion Fixed Abrasive Web systems qualified and in production at fabs in the United States, Europe and Asia.