3M Acquiring W.L. Gore Unit

Electronic News, Sept 18, 2000 by Bernard Levine

3 MIS EXPANDING ITS IC-packaging prowess. The St. Paul, Minn.-based firm is acquiring the Eau Claire, Wis.-based single-chip module substrate business also known as the high-density, multilayer IC packaging business of W.L. Gore & Associates, Newark, Del. Financial details were not disclosed. The transaction still depends on customary regulatory approvals. "This business is an important strategic fit, complementing our integrated circuit packaging business," said Rich Iverson, division vice president, 3M Electronic Products division, Austin. "When coupled with the 3M flexible circuit business, it extends our technological offering, providing one of the most comprehensive portfolios in IC packaging."

The 300-plus person business unit will join the 3M Electronic Products division, which manufactures 3M brand Microflex Circuits for inkjet printers, hard-disk-drive applications, a variety of IC packaging applications as well as other applications such as medical equipment and displays. The unit will remain at its Eau Claire location