Electronic News

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Articles in Oct 21, 2002, issue of Electronic News

• Wanna race? throttle up with AMD's Opteron, Intel's Banias and IBM's 64-bit desktop MPU - Microprocessor Forum 2002
  by Tom Murphy
• Intel integrates XScale, StrataFlash on a package: new processor, memory designed for cellular handsets - Semiconductors
  by Tom Murphy
• Big in Europe, small in Asia: China IP problems spook distributors - Supply Chain - Industry Overview
  by Rob Spiegel
• Count 'Em - The Antenna - Brief Article
• Reporter's notebook - News
  by Jeff Chappell
• Networked storage game heats up - Semiconductors - Astute Networks NSP Pericles
  by Gale Morrison
• Patriotism in Phoenix - Supply Chain - Avent - Brief Article
• Hot delivery - The Antenna
• Agere, Huawei sign multimillion-dollar deal - News Flash
  by Gale Morrison
• IC makers head to motor city - Semiconductors - Industry Overview
  by Gale Morrison
• Pushing out the limits of copper - Components
  by Joseph Fjelstad
• Automotive move - The Antenna - Convergence 2002 Automotive Show - Brief Article
• Agere files patent lawsuit against Intersil - News Flash
  by Peter Brown
• Stretching to serve global customers: partnerships, acquisitions, greenfield expansion and use of vendors comprise the world distribution mix - Supply Chain - Industry Overview
  by Rob Spiegel
• ESEC cuts 60 jobs worldwide - The Package - Brief Article
• Looking on the bright side - The Back Page - Jerald Fishman, president and CEO of Analog Devices - Interview
  by Ed Sperling
• Is it time for VIA's C3 to shine? faster processors are facing waning demand - News
  by Tom Murphy
• Tyco taps Richardson - Off the Shelf - Tyco Electronics - Brief Article
  by Rob Spiegel
• ASE orders K&S ball bonders - The Package - Advanced Semiconductor Engineering - Brief Article
• Electronic News Online - Brief Article
• Editor's note - conflicts between distributors and component suppliers versus contract manufacturers - Editorial - Industry Overview
  by Ed Sperling
• Boundless partners with Arrow - Off the Shelf - Brief Article
  by Rob Spiegel
• PAC Tech USA readying bump facility - The Package - PacLine 2000 A50 manufacturing process - Brief Article
• Brave new world - Biotech - IMEC consortium's plans
  by Jeff Chappell
• Letters
• Premier Farnell contracts with Vauxhall - Off the Shelf - Brief Article
  by Rob Spiegel
• Opto review this week - The Package - symposium at Binghamton, NY - Brief Article
• Clinging to Q4 hopes: Q3 hits industry hard, squelching gains made earlier in the year - Industry Overview
  by Jeff Chappell
• ADSL chipset design trends - In-Stat/Insights
  by Sam Lucero
• Summit signs eight distributors - Off the Shelf - Summit Design - Brief Article
  by Rob Spiegel
• Astec Power offering - The Package - LPQ142 - Brief Article
• Penny wise, tons foolish: low-quality components flood consumer market, create testing nightmare for OEMs - Industry Overview
  by Bernard Levine
• Business & Finance - securities prices - Industry Overview
• Richardson announces dividend - Off the Shelf - Richardson Electronics - Brief Article
  by Rob Spiegel
• Virage broadens its horizons - The Antenna - Virage Logic - Brief Article
• Vendors prep for recovery: pockets of demand hint at a broader market recovery - and related article - Industry Overview
  by Rob Spiegel
• Red ink, pink slips — blue Christmas likely - Earnings Reports - Industry Overview
  by Heidi Elliott
• Avnet uses XRT for treasury platform - Off the Shelf - Brief Article
  by Rob Spiegel
• Lessons from the auto industry - The Antenna - Brief Article - Industry Overview