Manufacturing Industry

ASE orders K&S ball bonders - The Package - Advanced Semiconductor Engineering - Brief Article

Electronic News, Oct 21, 2002

SEMICONDUCTOR ASSEMBLY SUBCONTRACTOR ADVANCED Semiconductor Engineering Inc. (ASE) has ordered 350 Max[micro]m automatic ball bonders from Kulicke & Soffa Industries Inc. (K&S). K&S is shipping the machines to ASE's Kaohsiung, Taiwan, production facility. The ball bonders will be used to manufacture ultra-fine-pitch, high-lead-count advanced BGA semiconductor packages, the company said.

COPYRIGHT 2002 Reed Business Information
COPYRIGHT 2002 Gale Group

 

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