Manufacturing Industry

PAC Tech USA readying bump facility - The Package - PacLine 2000 A50 manufacturing process - Brief Article

Electronic News, Oct 21, 2002

PAC TECH USA, A WHOLLY OWNED SUBSIDIARY OF PAC TECH GmbH, has begun construction of its 2,000-square-foot wafer bumping and solder stencil printing production facility. The new contract services facility, located in Santa Clara, Calif., will be completed and functional in November.

"The new PacLine 2000 A50 will have the capacity of bumping 600,000 wafers per year," said Thorsten Teutsch, CTO for Santa Clara-based Pac Tech USA. "The new production line will be able to handle up to 300mm wafers and is scheduled to be ISO 9001 certified in the third quarter of 2003."

In addition to the PacLine 2000 A50 services, Pac Tech will also offer solder ball bumping using its new solder jet SB2 equipment. The equipment is designed for prototyping, flexible ball placement and laser reflow of solder balls. It is ideal for CSP, BGA, DCA, flip-chip, HDD, MEMs sensors, die, 3D modules and wafers up to 12 inches. The SB2 jet can place 10 balls per second, the company said, and is also designed for optical devices requiring gallium arsenide (GaAs) and gold/tin (AuSn) solder.

COPYRIGHT 2002 Reed Business Information
COPYRIGHT 2002 Gale Group

 

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