Electronic News

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Articles in Nov 25, 2002 issue of Electronic News

• TiVo picture gets fuzzy: Replay TV companies license technology for set-top boxes - News - Industry Overview
  by Alex Romanelli
• TI rolls power digital control: complex demands of comms gear first in line - DSP - Mixed Signal - Texas Instruments Inc
• China's domestic market heats up: CM shift dwarfed by indigenous market - Supply Chain - contract manufacturers
  by Rob Spiegel
• Parts order index flat: fifth straight month without improvement - Packaging - monthly index from the Electronic Components, Assemblies and Materials Association - Brief Article - Industry Overview
  by Bernard Levine
• Happier holidays - The Antenna - Taiwan Semiconductor Manufacturing Company Ltd - Brief Article
• Intel, foundries converging: project management services propel growth for tiny Intel division - News
  by Tom Murphy
• DiagnoSYS buys Schlumberger division - The Test Floor - Brief Article
• Synopsys promotes FPGA through distribution - Off the Shelf - Brief Article
  by Rob Spiegel
• Resettable - The Package - Raychem Circuit Protection's PolySwitch SMD050-2018 - Brief Article
  by Bernard Levine
• Editor's note - Viewpoint - Editorial
  by Ed Sperling
• Sitting around and gathering dust: suppliers say warehoused parts aren't perishable; not all customers agree - Industry Overview
  by Rob Spiegel
• Agent of change: Infineon Technologies' Ulrich Schumacher is adapting to stay ahead of his company's rivals - DSP - Mixed Signal
  by David Manners
• ASE adopts Cadence design flow - By Design - Advanced Semiconductor Engineering - Brief Article
• Correction
• Where's a bobby when you need one? - The Antenna - theft of Samsung components - Brief Article
• Transmeta strikes back: but will OEMs notice the Astro TM8000? - News
  by Tom Muprhy
• Keithley jumps into RF test with 3G power analyzer - The Test Floor - Brief Article
• Arrow to distribute SuSE Linux - Off the Shelf - Brief Article
  by Rob Spiegel
• Flextronics International watching it at Comdex - The Package - collaboration with Fossil to make the Wrist PDA - Brief Article
  by Bernard Levine
• Electronic News Online - Brief Article - Industry Overview
• Q3 stats reveal painful story: chipmakers jumped the gun in Q2; toolmakers paid the price in Q3 - according to Semiconductor Equipment and Materials International - Industry Overview
  by Jeff Chappell
• IP outsourcing—resolving the 'make vs. buy' dilemma - Opinion
  by Kevin Donnelly
• Bridging the gap between design and manufacturing - Design Strategies
  by Hein van der Wildt
• Brooks-PRI continues layoffs - News Flash - Brief Article
• Lines are getting longer - The Antenna - Smith and Associates report on demand for semiconductor products - Brief Article
• Auto component market rises - News
  by Rob Spiegel
• Optonics sees the light: startup, Moto see promise in opticpal circuit failure analysis - Capital Equipment - Optomics Emiscope
  by Jeff Chappell
• Ripe for consolidation - Supply Chain - Brief Article - Industry Overview
  by Rob Spiegel
• ChipPac stretching wire bond tech - Packaging - Brief Article
  by Bernard Levine
• Biggest test - The Back Page - interview of Agilent Technologies CEO Ned Barnholt - Interview
  by Ed Sperling
• The shot heard around the web - In-Stat/Insights - Industry Overview
  by Eric Mantion
• Matsushita Electric joins IMEC for research - The Fab Line - Brief Article
• Transcom, Avnet makes global deal - Off the Shelf
  by Rob Spiegel
• Material move - The Package - Polyclad Laminates' Polyclad GI-785 and Polyclad GI-787 polyimide copper-clad laminates - Brief Article
  by Bernard Levine
• Cutting edge - Viewpoint - Column
  by Bernard Levine
• Units up, next comes recovery: but low parts prices remain the spoilsports - Industry Overview
  by Bernard Levine
• Broadcom takes swipe at enterprise: wireless LAN and Ethernet for blades dominate Comdex - Semiconductors
  by Tom Murphy
• Top 3 considerations regarding interface development - Opinon
  by Ron Nikel
• Stop the Abuse - Op Amp - Off the Shelf
  by Rob Spiegel
• Who cares about price? - The Antenna - Bishop and Associates report on connectors - Brief Article
• Business & finance - Industry Overview
• TEL subsidiary settles with two suppliers - The Fab Line - Tokyo Electron Arizona Inc - Brief Article
• Arrow taps GDA as SCES partner - Off the Shelf
  by Rob Spiegel
• Surface Mount with Character - The Package - IPC-9850 Surface Mount Placement Equipment Characterization - Brief Article
  by Bernard Levine
• Gearing up to 42V - Automotive
  by Suzanne Deffree
• Embedded MPUs in cell-based designs - Opinion
  by Gerry Worchel
• Sematech teams with Lasertec - The Fab Line - Brief Article
• HP storage program strengthened - Off the Shelf - by Avnet Hall-Mark - Brief Article
  by Rob Spiegel
• Designer Summit - The Package - IPC Designers Summit, Mar 22-27, 2002 - Calendar
  by Bernard Levine