ASE adopts Cadence design flow - By Design - Advanced Semiconductor Engineering - Brief Article

Electronic News, Nov 25, 2002

CADENCE DESIGN SYSTEMS INC. ANNOUNCED today that Advanced Semiconductor Engineering Inc. (ASE) has established an analysis-driven IC packaging design flow based on Cadence's Advanced Package Engineer (APE).

The deployment of the ASE design flow allows engineers on both sides of the design to analyze the system interconnect, Cadence said, adding that APE provides package-level interconnect characterization and signal integrity analysis.

"Our customers are facing strong and various design challenges as they move to nanometer design," said J.J. Lee, ASE VP of research and development, in a statement. "Adopting the Cadence IC packaging environment enables us to bring to the market a comprehensive and integrated packaging solution, one that addresses the challenges of high-speed, high-data rate designs."

Meanwhile, Cadence's SpecctraQuest for IC packaging design and analysis tool is integrated in the ASE design flow to allow development of constraints for the interconnect through pre-layout exploration, constraint-driven interconnect implementation and concurrent validation.

"With ASE's adoption of Advanced Packaging Engineer, our common customers benefit from a tighter, better integrated design chain," said Matthew Chan, Cadence's president of Asia Pacific, in a statement.