Manufacturing Industry
Qualcomm's Spinco, TI Sign Cross-License Pact
Electronic News, Dec 11, 2000 by Tom Murphy
SAN DIEGO-BASED QUALcomm Inc. and Texas Instruments Inc. said they have signed a cross-licensing agreement that covers both firms' patent portfolios. The deal, which includes TI's DSP and analog patents as well as Qualcomm's CDMA patents, will allow both companies to supply ICs for all wireless standards including 3G applications.
The agreement between Dallas-based TI and Spinco, the temporary name for Qualcomm's previously announced spin-off company, will allow Spinco to supply ICs for all wireless and wireline applications, Qualcomm said. The agreement covers all patents filed prior to or on Dec. 31, 2005. Specific details were not released. Qualcomm, a pioneer of CDMA digital wireless technology, announced in July that it was spinning off its IC and systems software business and that it planned to file for an IPO.
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