Manufacturing Industry

Blue move - The Antenna - Advanced Semiconductor Engineering's technology - Brief Article

Electronic News, Feb 25, 2002

ADVANCED SEMICONDUCTOR ENGINEERING INC. (ASE) introduced a fine pitch bonding (FPB) technology for Bluetooth ICs; it also said it's been working with Cambridge Silicon Radio (CSR) to build a next-generation Bluetooth chip with a single-chip implementation of the baseband, microcontroller, memory and radio.

The Taipei, Taiwan, company said its facility in Chung Li, Taiwan, is providing Cambridge, England-based CSR with packaging and test services including the application of ASE's FPB packaging technology, said to feature smaller solder balls and a finer pitch than conventional BGA (ball-grid array) products.

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COPYRIGHT 2002 Gale Group

 

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