SEMI opens 300mm transition program

Electronic News, July 31, 1995

MOUNTAIN VIEW, CALIF.--Semiconductor Equipment & Materials International (SEMI) has unveiled a new program aimed at coordinating the transition of the industry to production on 300-millimeter (12-inch) wafers, which it called the most significant challenge facing the semiconductor equipment industry.

SEMI president William H. Reed said the organization's board unanimously adopted a resolution calling for SEMI to take a proactive role in assisting its members as well as the semiconductor industry within the 1997-2000 time-frame, by which time the industry will be building major new wafer fabrication plants throughout the world that will need the 300mm capability.

"This is a bold move on SEMI's part, but we feel it is necessary for a successful transition to the next-generation wafer of semiconductor production. The stakes are too high for individual companies, whether customers or vendors, to go it alone in this effort," Mr. Reed said.

He said the SEMI board approved a plan to lead the implementation through a dedicated equipment and materials development effort with the emphasis on cost efficiencies.

"It has been estimated that it will cost the global semiconductor industry and its suppliers as much as $14 billion to develop a 300-millimeter capability by the end of the decade. The result, however, will be a further lowering of the cost of memory chips and microprocessors that will drive new applications of computers and telecommunications into the new century," Mr. Reed said.

Among action items for SEMI: coordinating worldwide standards development efforts to meet 300mm requirements; establishing a new 300mm division within SEMI with three or more full-time professionals dedicated to identifying transition issues; establishing a committee of the board of directors to oversee the effort; initiating worldwide visits to all major semiconductor device manufacturers in order to understand their 300mm transition timetables and related equipment and materials needs; working with all appropriate regional semiconductor groups to coordinate supplier efforts supporting 300mm production; disseminating information on the transition to the media and to SEMI members worldwide through industry symposia and direct contact by SEMI regional offices.

Unlike last year, when equipment and materials companies were less than enthusiastic about the plans of some device manufacturers to move to 300mm wafers, talk of moving to the larger silicon substrate was one of the hot topics at the recent Semicon/West (EN, July 17). Sass Somekh, Applied Materials' senior VP of world product operations, projected the transition to 300mm wafers would begin at the end of 1996 or by the end of 1997. From now on, he said, Applied will design its equipment for production with both 200mm and 300mm wafers.